Raw material polishing device for machining

A technology for mechanical processing and raw materials, which is applied in the field of raw material grinding devices for mechanical processing, can solve the problems of only one workpiece being polished, low grinding efficiency, and increased grinding costs, so as to achieve intelligent control of work efficiency, improve grinding practicability, and improve The effect of work efficiency

Inactive Publication Date: 2021-03-05
李卓亮
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although the current raw material grinding device for mechanical processing can grind the surface of the workpiece, the grinding efficiency is low, and only one workpiece can be polished at a time, which increases the cost of grinding. Vibration will occur during the grinding process, and the devic

Method used

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  • Raw material polishing device for machining
  • Raw material polishing device for machining
  • Raw material polishing device for machining

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] see Figure 1 ~ Figure 3 , a raw material grinding device for mechanical processing, comprising a base plate 1, universal wheels 2 are installed at the four corners of the bottom of the base plate 1, and the upper part of the base plate 1 is fixedly connected with a support plate 9 through a buffer and shock absorbing assembly, and the support plate A cover plate 10 is connected above the support plate 9, and a lifting assembly is provided between the support plate 9 and the cover plate 10. The lifting assembly runs through the cover plate 10 and is rotatably connected with the top plate 19. A threaded plate 20 is provided below the top plate 19. The bottom of the threaded plate 20 is provided with a grinding assembly, and the top of the cover plate 10 is provided with a fixed assembly. The shock absorbing assembly is used to effectively reduce the vibration generated during the working process of the device. Through the fixed assembly, multiple The workpiece to be poli...

Embodiment 2

[0032] see Figure 1 ~ Figure 4, as a raw material grinding device for mechanical processing in Example 1, including a base plate 1, universal wheels 2 are installed at the four corners of the bottom of the base plate 1, and the upper part of the base plate 1 is fixed with a support plate 9 by a buffer and shock absorbing assembly connection, a cover plate 10 is connected above the support plate 9, a lifting assembly is arranged between the support plate 9 and the cover plate 10, the lifting assembly runs through the cover plate 10 and is connected with the top plate 19 in rotation, and the bottom of the top plate 19 There is a threaded plate 20, the bottom of the threaded plate 20 is provided with a grinding assembly, and the upper part of the cover plate 10 is provided with a fixed assembly, which can effectively reduce the vibration generated during the working process of the device by using the buffer and shock absorbing assembly. , can quickly fix multiple workpieces to b...

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PUM

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Abstract

The invention discloses a raw material polishing device for machining, belongs to the technical field of machining and solves the problems that an existing raw material polishing device for machiningonly can polish one workpiece at a time and cannot absorb shock. The device is technically characterized by comprising a bottom plate, wherein universal wheels are mounted at four corners of the bottom of the bottom plate; the upper portion of the bottom plate is fixedly connected with a supporting plate through a buffer damping assembly, the upper portion of the supporting plate is connected witha cover plate, a lifting assembly is arranged between the supporting plate and the cover plate, the lifting assembly penetrates through the cover plate and is rotatably connected with a top plate, athreaded plate is arranged below the top plate, a polishing assembly is arranged at the bottom of the threaded plate, and a fixing assembly is arranged above the cover plate. Vibration is weakened through a buffering and damping assembly, multiple to-be-polished workpieces can be polished at a time through the fixing assembly and the polishing assembly, the polishing efficiency is improved, and the device has the beneficial effects of buffering and damping, efficient polishing, simplicity, convenience and practicability and improvement of the working efficiency.

Description

technical field [0001] The invention relates to the technical field of mechanical processing, in particular to a raw material grinding device for mechanical processing. Background technique [0002] Machining refers to the process of changing the shape or performance of a workpiece through a mechanical device. According to the difference in processing methods, machining can be divided into cutting processing and pressure processing. The production process of a machine refers to the entire process of making a product from raw materials (or semi-finished products). For machine production, it includes transportation and storage of raw materials, production preparation, blank manufacturing, processing and heat treatment of parts, product assembly, debugging, painting and packaging, etc. The content of the production process is very extensive. Modern enterprises use the principles and methods of systems engineering to organize and guide production, and regard the production pro...

Claims

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Application Information

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IPC IPC(8): B24B19/00B24B41/00B24B47/22B24B47/12B24B41/06F16F15/067
CPCB24B19/00B24B41/007B24B41/06B24B47/12B24B47/22F16F15/067
Inventor 李卓亮
Owner 李卓亮
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