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Vacuum bonding device

A bonding device and bonding technology, which are applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as the alignment accuracy of wafers and bonding substrates, and achieve the effect of solving alignment accuracy

Pending Publication Date: 2021-03-05
苏州工业园区纳米产业技术研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a vacuum bonding device, which can solve the problem of the alignment accuracy of the wafer and the bonding substrate, and at the same time, in the process of extracting the flag, the wafer and the bonding substrate will not be displaced by force

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Embodiment Construction

[0023] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0024] It should be noted that terms such as "upper", "lower", "left", "right", "inner" and "outer" in the present invention are only used to describe the present invention with reference to the accompanying drawings, and are not used as limiting terms.

[0025] See Figure 1 to Figure 3 , a vacuum bonding device, comprising a vacuum chamber 1, a carrier table 2 and a bonding tool 3 are arranged in the vacuum chamber 1, the carrier table 2 is used for loading wafers and bonding substrates, and the bonding The jig 3 includes a bonding component 31 , a positioning component 32 and a limiting component 33 for bonding, positioning and limiting the wafer and the bonding substr...

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Abstract

The invention relates to a vacuum bonding device. The vacuum bonding device comprises a vacuum chamber; a bearing platform which is arranged in the vacuum chamber and is used for loading a wafer and abonding substrate; and a bonding jig which is arranged in the vacuum chamber and comprises a bonding assembly, a positioning assembly and a limiting assembly so as to carry out bonding, positioning and limiting on the wafer and the bonding substrate respectively. According to the vacuum bonding device, the problem of alignment accuracy of the wafer and the bonding substrate can be solved, and meanwhile, the wafer and the bonding substrate cannot be stressed to deviate in the flag extracting process.

Description

technical field [0001] The invention relates to a vacuum bonding device, which belongs to the field of wafer bonding equipment. Background technique [0002] Wafer vacuum bonding generally includes a vacuum anode bonding process and a vacuum temporary bonding process. However, during the feeding process of current vacuum bonding equipment, the alignment of the bonding glass and the wafer depends entirely on manual adjustment, and the alignment accuracy is difficult to control. At the same time, during the vacuum bonding process, when the flag is pulled out from between the bonding glass and the wafer, the bonding glass will move, so in the original structural design, the left and right sides of the bonding fixture are designed as follows Press-type fixed arm to fix the bonding glass and wafer (the spring mechanism generates a downward pulling force). Pressing down on the arm creates localized contact between the bonding glass and the wafer. This "local contact" has no adve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/68
CPCH01L21/67092H01L21/68
Inventor 张志清
Owner 苏州工业园区纳米产业技术研究院有限公司