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Light emitting device and light transceiving module

A technology of optical emitting device and optical transceiver module, which is applied in the field of optical communication, can solve the problems of large size and difficult to complete circuit board layout, etc., and achieve the effects of solving optical port alignment accuracy, compact structure, and improving yield

Inactive Publication Date: 2020-09-25
GUANGXUN SCI & TECH WUHAN
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The invention provides an optical emitting device and an optical transceiver module to solve the technical problem in the prior art that the size of the optical device after packaging is large and it is difficult to complete the layout of the circuit board

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  • Light emitting device and light transceiving module
  • Light emitting device and light transceiving module
  • Light emitting device and light transceiving module

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Embodiment Construction

[0035] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. The descriptions of "first", "second" and so on in the present invention are only for the purpose of description, and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity or order of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0036] refer to Figure 1 to Figure 3 , the first aspect of the embodiment of the present application provides a light-emitting device, including a collimator assembly 17 and a laser assembly 12, a first optical path conversion assembly 13, a z-block assembly 14 and a second The optical path conversion...

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Abstract

The invention provides a light emitting device and a light transceiving module. Multiple paths of light beams emitted by a laser assembly in a light emitting device are input into a first light path conversion assembly to be converted into multiple paths of collimated light, the multiple paths of collimated light are input into a z-block assembly to be combined into one path of collimated light, and the path of collimated light is input into a second light path conversion assembly to be bent by 180 degrees and then output and coupled into a collimator assembly; the collimator assembly comprises a collimator and a first connector, and the first connector is connected with the collimator through a first optical fiber. According to the light emitting device, the collimator assembly and otherelements of the light emitting device are arranged in a layered mode, the space utilization rate of the light device in the direction perpendicular to the light path is increased, meanwhile, the length of the light emitting device is reduced, the structure is more compact, and the requirement for circuit board layout is met. And the collimator is flexibly connected with the first connector, so that the problem of optical port alignment precision is solved, and enough space is provided for placement of the first optical fiber.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to an optical emitting device and an optical transceiver module. Background technique [0002] Optical modules are gradually evolving from 100Gbps to 400Gbps. IEEE and many MSA organizations have formulated PMD and module packaging standards for 400G optical modules in various application scenarios. The PMD layer adopts single-wavelength 100Gb / s PAM4, and QSFP-DD package or OSFP package is the mainstream packaging technology for 400G optical modules. Compared with the 100G optical module, the circuit of the 400G optical module is more complex, and requires a digital signal processor for signal processing, and various auxiliary circuits, and requires a larger space when the circuit board is laid out; but the volume of the 400G optical module after packaging The standard has not been increased, which requires compressing the size of the light emitting component and the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
CPCG02B6/4206G02B6/421G02B6/4214
Inventor 马洪勇孙莉萍胡强高朱虎苏敬奎周日凯付永安胡毅罗勇
Owner GUANGXUN SCI & TECH WUHAN