Packaging sheet rapid stamping die
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 广州迎善信息科技有限公司
- Publication Date
- 2021-03-09
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the field of molds, in particular to a rapid stamping mold for packaging sheets. Background technique
[0002] The stamping strips on the high-efficiency automatic stamping die are automatically fed for stamping, that is, the conveying step size is controlled by a special feeding mechanism. If the feeding mechanism has high precision in the conveying step size, the dimensional accuracy of the stamped products is also high. high.
[0003] In the prior art, the central end of the stamping part is impacted up and down by the overall mold panel to form a die-casting process, and the strong interaction between the stamping die and the plate during the die-casting process will generate a large amount of metal chips during the processing of the plate. When the hole is opened, the metal shavings will enter the hole together, which will reduce the accuracy of the hole distance, and the hole will form a chip groove, that is, the pass ra...