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A chip packaging method based on a light-transmitting plate and its packaging structure

A chip packaging and light-transmitting plate technology, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problem that the connection method between the chip and the packaging circuit cannot adapt to the finer circuit, so as to reduce the difficulty of packaging. , the effect of improving production efficiency and simplifying the process

Active Publication Date: 2021-06-25
广东佛智芯微电子技术研究有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the embodiment of the present application is to provide a chip packaging method and its packaging structure based on a light-transmitting plate, which solves the problem that the existing connection method between the chip and the packaging circuit cannot adapt to a more refined circuit, and can greatly reduce the difficulty of chip packaging. Improve production efficiency and reduce costs

Method used

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  • A chip packaging method based on a light-transmitting plate and its packaging structure
  • A chip packaging method based on a light-transmitting plate and its packaging structure
  • A chip packaging method based on a light-transmitting plate and its packaging structure

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Experimental program
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Effect test

Embodiment 1

[0052] In step A, specifically include the following steps:

[0053] A1. Provide a light-transmitting plate 10, the light-transmitting plate 10 has a first side and a second side opposite to each other along its thickness direction, and the second laser 210 is used to target the area with a preset line shape on the first side of the light-transmitting plate 10 11 Carry out irradiation modification;

[0054] A2. Soak the light-transmitting plate 10 in hydrofluoric acid or hydrogen fluoride solution for etching, so that the first side of the light-transmitting plate 10 forms a groove 12 or a through hole 121 with a preset circuit shape.

[0055] In practical application, the second laser 210 in step A1 is emitted by the second laser 200, and the second laser 210 adopts carbon dioxide laser, YAG laser, semiconductor laser, green laser, argon ion laser, ultraviolet laser, near infrared laser or diode-pumped solid-state lasers. Preferably, in the chip packaging method based on a ...

Embodiment 2

[0062] In the chip packaging method based on the light-transmitting plate of Embodiment 2 of the present application, in step B, the following steps are included:

[0063] B1. Provide nano conductive metal particles 20 and a solvent to make nano conductive metal paste;

[0064] B2, filling the nano conductive metal paste in the groove 12 or the through hole 121;

[0065] B3, drying and semi-curing the nano conductive metal paste in the groove 12 or the through hole 121, if the height of the nano conductive metal paste is lower than the depth of the groove 12 or the through hole 121, then repeat step B2 to make the nano conductive metal paste The height of the conductive metal paste is not lower than the depth of the groove 12 or the through hole 121 .

[0066] It should be noted that in step B1, the solvent can be ethanol or ethylene glycol or other volatile organic alcohols, which can also play a role in isolating the air to prevent the oxidation of nano-scale conductive met...

Embodiment 3

[0073] In the chip packaging method based on the light-transmitting plate of Embodiment 3 of the present application, after step D, the following steps are also included:

[0074] S1. Fabricate a redistribution layer on the second side of the light-transmitting plate, and the redistribution layer is electrically connected to the predetermined circuit;

[0075] S2. Providing at least one second chip, disposing the second chip at a predetermined position of the redistribution layer, and electrically connecting the electrical signal connection bumps of the second chip to the redistribution layer;

[0076] S3. Fabricate a second plastic encapsulation layer on the redistribution layer, the second plastic encapsulation layer encloses the second chip to obtain a 3D stack package structure.

[0077] It should be noted that, the process of manufacturing the redistribution layer on the second side of the light-transmitting plate 10 can be specifically: firstly laminate a dielectric mate...

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Abstract

The present application provides a chip packaging method based on a light-transmitting plate and its packaging structure, including: providing a light-transmitting plate, etching a groove or a through hole with a preset line shape on the first side of the light-transmitting plate; providing a nano-conductive metal Particles, nano conductive metal particles are filled in grooves or through holes; at least one first chip is provided, the first chip is arranged at a preset position on the first side of the light-transmitting plate, and the electrical signal of the first chip is connected The bumps are connected to the nano-conductive metal particles; the first laser is used to irradiate the nano-conductive metal particles on the second side of the light-transmitting plate, so that the nano-conductive metal particles are sintered to form a preset circuit, and the electrical signals of the first chip are connected The bumps are electrically connected with the preset circuits. This application takes advantage of the light-transmitting advantages of the light-transmitting plate, and uses laser to sinter the nano-conductive metal particles directly on the other side of the light-transmitting plate. While the packaging circuit is formed, it also realizes the electrical connection between the chip and the packaging circuit, simplifying the process. process.

Description

technical field [0001] The present application relates to the technical field of chip packaging, in particular to a chip packaging method based on a light-transmitting plate and a packaging structure thereof. Background technique [0002] With the rapid development of modern electronic information technology, electronic products are gradually developing in the direction of miniaturization, portability and multi-function. With the development of electronic products towards miniaturization, their packaging circuits are also developing towards high density, high precision, fine pitch, high reliability, multi-layer and high-speed transmission. [0003] At present, it is usually used to pre-fabricate the pads on the packaging circuit, and then mount the chip on the packaging circuit to ensure that the electrical signal connection bumps of the chip are connected to the pads, and then the chip and the package are realized by melting the pads at high temperature. Fixing and electri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/07H01L23/31H01L21/56
CPCH01L21/561H01L23/3121H01L25/071
Inventor 杨斌崔成强罗绍根
Owner 广东佛智芯微电子技术研究有限公司