Unlock instant, AI-driven research and patent intelligence for your innovation.

A machine program control method and device

A program control method and program technology, applied in program control, electrical program control, comprehensive factory control, etc., can solve the problems of a large number of flow recipes and unfavorable manufacturing efficiency, and achieve the effect of reducing the number, increasing the calling speed, and improving the processing efficiency

Active Publication Date: 2021-09-24
YANGTZE MEMORY TECH CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the advancement of technology, Track recipes have more and more sub recipes. When there is a demand for parameter changes in each sub recipe, a corresponding flow recipe needs to be created, resulting in a large number of flow recipes, which is not conducive to improving manufacturing efficiency in actual operation.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A machine program control method and device
  • A machine program control method and device
  • A machine program control method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0043] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0044] Secondly, the present invention is described in detail in combination with schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged according to the gener...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the present application discloses a machine program control method and device, which can obtain subprograms to be executed, use the inter-batch R2R control system to call the subprograms to be executed, and perform the process corresponding to the subprograms to be executed according to the subprograms to be executed. Since the R2R control system can directly call the subroutine to be executed, for the newly created subroutine to be executed, there is no need to combine other existing programs to form a new flow formula, thus reducing the number of flow types and increasing the calling speed of the recipe. Thereby, the processing efficiency of the semiconductor device is improved.

Description

technical field [0001] The present application relates to the field of semiconductor device manufacturing, in particular to a machine program control method and device. Background technique [0002] At present, in the semiconductor manufacturing industry, semiconductor manufacturing factories have to produce a wide variety of semiconductor devices in different quantities at the same time, and various types of semiconductor devices have different processing techniques, different processing time periods, and different processing quantities. Various types of semiconductor devices Delivery dates and delivery quantities requested by customers also vary. Under such complex conditions, how to improve the production efficiency of machines has increasingly become the key to the survival and development of semiconductor companies in the fierce competition. [0003] In recent years, the semiconductor manufacturing industry generally requires improvement of management level in order to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/418
CPCG05B19/41835G05B19/41865Y02P90/02
Inventor 阮厚航游凯张鹏真李翠阁
Owner YANGTZE MEMORY TECH CO LTD