DFM comprehensive scoring method
A comprehensive scoring and scoring technology, applied in CAD circuit design, special data processing applications, computer-aided design, etc., can solve problems such as inability to carry out, not comprehensive enough, and no DFM comprehensive inspection results
Pending Publication Date: 2021-03-12
SHANGHAI HUALI MICROELECTRONICS CORP
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Problems solved by technology
[0003] The traditional DFM analysis is to check, control and give feedback on each item separately, and judge whether each item affects the known shape of the layout independently. There is no overall DFM comprehensive inspection result, which is not comprehensive enough
Moreover, it is not possible to perform correlation checks on subsequent product yields, defects, or other wafer quality results.
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[0033] The specific implementation manner of the present invention will be described in more detail below with reference to schematic diagrams. The advantages and features of the present invention will be more apparent from the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.
[0034] Hereinafter, the terms "first", "second", etc. are used to distinguish between similar elements, and are not necessarily used to describe a specific order or chronological order. It is to be understood that these terms so used are interchangeable under appropriate circumstances. Similarly, if a method described herein includes a series of steps, the order in which these steps are presented is not necessarily the only order in which these steps can be performed, and some described steps may be omitted and / or...
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The invention provides a DFM comprehensive scoring method which comprises the following steps of: scoring the abnormal risk degree and abnormal occurrence degree of each inspection item of a mass production product to obtain a first risk degree score, a first occurrence degree score and a first weight of each inspection item; obtaining a first total score according to the weight, the first risk degree score and the first occurrence degree score, analyzing the correlation between the first total score and the yield, and formulating a management and control standard according to the yield requirement; scoring the abnormal risk degree and the abnormal occurrence degree of each inspection item of the to-be-tested product to obtain a second risk degree score, a second occurrence degree score and a second weight of each inspection item of the to-be-tested product; obtaining a second total score; judging whether the second total score reaches a control standard or not. Each inspection item ofthe to-be-detected product is scored comprehensively, so that the DFM inspection result is summarized comprehensively, and correlation analysis convenient for subsequent wafer quality detection is found out.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a DFM comprehensive scoring method. Background technique [0002] Design for Manufacturability (DFM) refers to new design techniques, tools and methods adopted to ensure the effective transfer of layout graphics, control parameter deviation and improve yield. With the continuous development of integrated circuit technology and the continuous shrinking of pattern size, only a single defect may cause a chip containing millions of transistors to fail, which highlights the importance of DFM. As the complexity of layout graphics continues to increase, the inspection items of DFM are also gradually increasing. Accurately carry out various inspections on the layout, find high-risk process areas, and give early warning of risky products. Successfully achieved tape-out and mass production of the product. [0003] The traditional DFM analysis is to check, control and give feedbac...
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Login to View More IPC IPC(8): G06F30/30G06F119/18
CPCG06F30/30G06F2119/18
Inventor 程玮朱忠华魏芳
Owner SHANGHAI HUALI MICROELECTRONICS CORP