Mica tape uniform gluing device for H-grade calcined mica tape electromagnetic wire production
A technology of calcining mica and gluing device, which is applied in the manufacture of circuits, electrical components, cables/conductors, etc. It can solve the problems of not being able to evenly apply gluing, not having fast air-drying, etc., to increase practicability, avoid glue settlement, The effect of improving quality performance
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[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0027] see Figure 1-6 , the present invention provides a technical solution: a mica tape uniform gluing device for H-grade calcined mica tape electromagnetic wire production, including a base 1, an adjustable support seat 2, a base anti-slip pattern 3, a console 4, and a box body Support base 5, first box body 6, second box body 7, adjustable brush roller seat 8, brush roller 9, mica tape 10, glue 11, threaded hole 12, threaded rod 13, water inlet valve 14, ...
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