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Dismounting method of high-density connector

A high-density connector and connector technology, which is applied in the maintenance and connection of line connectors, line/collector components, etc., can solve the problems of difficult control of heating, large energy consumption, scrapping of printed boards, etc., to avoid Pad peeling, damage reduction, and thermal damage avoidance effects

Active Publication Date: 2021-03-16
NO 709 RES INST OF CHINA SHIPBUILDING IND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the following defects will appear in the traditional disassembly method: since the pins are embedded in the shell, a large force is required to operate when pulling out, and a lot of physical strength will be consumed after pulling out all the pins; while pulling out, the solder joints and the solder in the through holes must be satisfied. Melting conditions, due to the shielding of the shell, it is impossible to observe or judge whether the through-hole solder is completely melted, and the heating time is not easy to control. If the heating time is too long or the heating time is not enough, pulling out the pins will easily cause the pad to fall off, causing the printed board to be scrapped.

Method used

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  • Dismounting method of high-density connector
  • Dismounting method of high-density connector
  • Dismounting method of high-density connector

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Embodiment Construction

[0029] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] The connection structure of the crimped and welded high-density connector is as follows: figure 1 As shown, there are two solder joints at the connection between the printed board 1 and the pin 3, which are the solder joints 6 on the welding surface and the solder joints 7 on the crimping surface, which are respectively located on the two surfaces of the printed board 1, and the connector shell 2 There is a support boss 4 on the back, and the pin 3 passes through the connector shell 2 and is embedded and fixed with it. The support boss 4, the solder joint 7 on the crimping surface, ...

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Abstract

The invention discloses a dismounting method of a high-density connector, which specifically comprises the following steps of: locally heating and softening embedded parts of connector pins and a connector shell by using heating equipment with a circular tube array, completely separating the connector shell from the pins by matching with a comb-shaped tool, heating welding points on a printed board, pulling out the pins one by one, and separating the pins and the printed board. According to the method provided by the invention, damage to each part of the connector in the dismounting process can be avoided to the maximum extent, and the method is simple and convenient to operate, labor-saving, high in dismounting efficiency and particularly suitable for crimping and welding high-density connectors.

Description

technical field [0001] The invention relates to the technical field of disassembly of printed board connectors, in particular to a method for disassembling high-density connectors, and is particularly suitable for crimping and welding high-density connectors. Background technique [0002] Some high-density connectors in aerospace products are crimped and then welded. Sometimes the high-density connectors are accidentally damaged or improperly plugged in subsequent use during the process of loading the printed circuit board into other equipment. The connector is damaged, so the connector needs to be replaced. For the disassembly of this kind of high-density connector that is crimped and then welded, the traditional disassembly method is: heat the solder joints on the welding surface of the high-density connector until the solder melts, then use pliers to clamp the pins on the crimping surface and pull it out, repeat the above operation Unplug all pins and finally remove the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/00H05K13/04
CPCH01R43/002H05K13/0486
Inventor 程虎
Owner NO 709 RES INST OF CHINA SHIPBUILDING IND CORP
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