Solvent-free conductive adhesive and preparation method thereof

A solvent-free, conductive adhesive technology, applied in the field of conductive adhesives, can solve the problems of easy aging, strong odor, and easy leakage of printing, etc., and achieve good electrical and thermal conductivity, broad application prospects, and low-cost practicability.

Active Publication Date: 2021-03-30
广州昊毅新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a component of the conductive adhesive, the organic solvent in these technical solutions can improve the process performance; but it also has many disadvantages, such as toxicity, environmental pollution, unstable contact resistance of the cured product, and fillers It is easy to delaminate with organic trees, so the solvent-free conductive adhesive is more suitable for today's green environmental protection requirements
[0003]

Method used

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  • Solvent-free conductive adhesive and preparation method thereof
  • Solvent-free conductive adhesive and preparation method thereof
  • Solvent-free conductive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0057] Example 1

[0058] In this case, the solvent-free conductive glue is composed of components of the following mass:

[0059]

[0060]

[0061] This example has the preparation method of such a solvent-free conductive glue as follows:

[0062] 1) According to the distribution, the solvent-free polyester resin and the dispersant BYK168 are mixed, and uniform is dispersed;

[0063] 2) Add a single-walled carbon nanotube slurry Matrix 201, high speed at a speed of 3000r / min, a high speed of 1 hour, to fineness ≤ 5 μm;

[0064] 3) Add the antifoaming agent TEGO900, disperse uniform;

[0065] 4) Add nano silver powder, uniform dispersion;

[0066] 5) Add HDI enclosed curing agent, uniform dispersion, resulting in finished products.

Example Embodiment

[0067] Example 2

[0068] In this case, the solvent-free conductive glue is composed of components of the following mass:

[0069]

[0070] The specific preparation method of this example is the same as that of Example 1.

Example Embodiment

[0071] Example 3

[0072] In this case, the solvent-free conductive glue is composed of components of the following mass:

[0073]

[0074] The specific preparation method of this example is the same as that of Example 1.

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Abstract

The invention discloses a solvent-free conductive adhesive and a preparation method thereof. The solvent-free conductive adhesive comprises the following components in parts by mass: 30-35 parts of solvent-free polyester resin; 2-3 parts of a latent curing agent; 0.3-0.5 part of single-walled carbon nanotube slurry; 1-3 parts of a dispersant; 0.2-0.5 part of an antifoaming agent; and 60-70 parts of nano silver powder. The solvent-free polyester resin is acrylate modified saturated polyester resin, and the dispersant is a block copolymer containing pigment affinity groups. The invention also provides a preparation method of the solvent-free conductive adhesive. The solvent-free conductive silver adhesive does not contain halogen, has good conductivity and excellent adhesion strength, can bedirectly used without blending of single components, does not need dry ice protection in the transportation process, has the advantages of simple preparation process, low cost, environmental protection and the like, is suitable for conductive adhesion and electrode extraction of solar conductive adhesives, LEDs and LCDs, and has a wide application prospect.

Description

technical field [0001] The invention relates to the technical field of conductive adhesives, in particular to a solvent-free conductive adhesive and a preparation method thereof. Background technique [0002] With the light, thin, small, integrated, and low-cost requirements of the microelectronics industry, the importance of conductive adhesives as a core basic material for the microelectronics industry as a substitute for lead-tin solder has become increasingly prominent. In recent years, new types of conductive adhesives have come out continuously in China, but most of them contain organic solvents, so the disadvantage of unstable contact resistance is very prominent. For example, Chinese patent document CN1931946A discloses a single-component silver-filled conductive adhesive that can be stored and transported at normal temperature, CN101245227A discloses a kind of epoxy conductive silver adhesive for LED and its manufacturing method, and CN101514281A discloses a conduct...

Claims

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Application Information

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IPC IPC(8): C09J151/08C09J9/02
CPCC09J151/08C09J9/02C08K2003/0806C08K2201/011C08K9/08C08K3/041C08K3/08
Inventor 张国华黄华
Owner 广州昊毅新材料科技股份有限公司
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