Method for calculating through hole number and resistance value of cross-layer chain type connection structure

A technology of chain connection and connection structure, applied in computing, computer-aided design, electrical and digital data processing, etc., can solve problems affecting testing and analysis, result error, repeated calculation, etc., to achieve accurate results, reduce errors, and concise steps Effect

Active Publication Date: 2021-04-02
SEMITRONIX
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it can be found that for complex structures with multiple types of vias (single vias / multiple vias) or multiple repeating units, the formula is cumbersome, easy to omit or repeat calculations, and there may be errors in the final results. May affect subsequent testing and analysis

Method used

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  • Method for calculating through hole number and resistance value of cross-layer chain type connection structure
  • Method for calculating through hole number and resistance value of cross-layer chain type connection structure
  • Method for calculating through hole number and resistance value of cross-layer chain type connection structure

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Embodiment 1

[0032] Such as figure 2 As shown, the method for calculating the number of vias in the cross-layer chain connection structure disclosed in Embodiment 1 of the present invention includes: step 1, obtaining the cross-layer chain connection structure to be calculated in the layout;

[0033] The cross-layer chain connection structure includes several connection lines and several through holes, and the connection lines are in the connection line layer M i , the vias are in the via layer V j in, and at V j The through holes in the layer are used to connect the connecting wires or pins (pins) in two adjacent connecting wire layers; where, i∈[1,E], j∈[1,F], E, F are greater than 1 of natural numbers. According to the layout, the connection lines in the cross-layer chain connection structure are divided into several sequentially connected structural blocks.

[0034] Such as image 3 As shown, in this embodiment, the cross-layer chain connection structure includes connecting lines...

Embodiment 2

[0042] In Embodiment 2, according to different application requirements, the method of calculating the resistance value of the cross-layer chain connection structure can further accurately calculate the resistance value of the cross-layer chain connection structure, and the calculation formula is as follows: ; wherein, the For connecting line layer M i The resistance value of the single-layer connection structure in the connection line layer M i The single-layer connection structure in includes M i The connection line in the layer; i∈[1,E], E is a natural number greater than 1. which gets the Specifically include: obtaining the number of squares of the single-layer connection structure; then multiplying the number of squares by the resistance of the square to obtain the resistance value of the single-layer connection structure . The L and W of the single-layer connection structure block in this embodiment are as shown in Figure 5 (a), in the layout, the single-layer c...

Embodiment 3

[0046] As shown in FIG. 6( a ), in this embodiment, when there is an overlap area between the end structure block polygon and the pin pin, the center point of the overlap area is taken as the common point G.

[0047] As shown in Figure 6(b), in this embodiment, when there is no overlapping area between the end structural block polygon and the pin pin but there is a shared side M, the shared side M overlaps with the length X of the end structural block polygon , the quadrilateral region S is extended from the common side M to the end structure block polygon, and the two adjacent sides of the quadrilateral region S are the shared side M and the width Y of the end structure block polygon respectively. The center point serves as the common point G.

[0048] As shown in Figure 6(c), in this embodiment, when there is no overlapping area between the end structural block polygon and the pin pin but there is a common side M, and the shared side overlaps with the width Y of the end struct...

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Abstract

The invention provides a method for calculating the number of through holes of a cross-layer chain type connecting structure. The method comprises the steps of dividing a connecting line into a plurality of structural blocks connected in sequence; identifying a skip layer structure block in the Mi layer, and identifying an overlapping region of the structure block or pin of the adjacent layer andthe skip layer structure block; and identifying the through holes in the overlapping region, and calculating the total number of the through holes according to the number of the through holes. The invention further provides a corresponding method for calculating the resistance value, and a formula is utilized. And omission and repeated calculation are avoided, errors can be effectively reduced, and then the accurate resistance value of the cross-layer chain type connection structure is obtained through calculation so as to guide selection of a test range. The steps are simple, the result is accurate, and improvement and optimization of the production process are facilitated.

Description

technical field [0001] The invention belongs to the field of semiconductor design and production, and in particular relates to a method for calculating the number of through holes and the resistance value of a cross-layer chain connection structure. Background technique [0002] In the semiconductor integrated circuit industry, high-performance integrated circuit chips require high-performance back-end electrical interconnections. Metal copper has been more and more widely used in integrated circuit chips due to its low resistivity characteristics. In the test of the cross-layer chain connection structure, different ranges will be selected for testing according to the resistance of the structure to improve the accuracy of the data. Therefore, the calculation of the resistance value of the cross-layer chain connection structure is one of the integrated circuit tests. important research topic. [0003] In the cross-layer chain connection structure, its resistance is usually ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/392G06F30/398G06F115/06
CPCG06F30/392G06F30/398G06F2115/06
Inventor 彭焱袁天浩
Owner SEMITRONIX
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