Wafer adsorption device with anti-falling function

Abstract

The invention relates to a wafer adsorption device with an anti-falling function. The wafer adsorption device comprises a connecting pipe and a suction nozzle, wherein the connecting pipe is vertically arranged; the suction nozzle is arranged at the bottom end of the connecting pipe; an executing mechanism and an auxiliary mechanism are arranged on the connecting pipe; the executing mechanism comprises an executing assembly and two locking assemblies, the executing assembly is arranged in the connecting pipe, and the two locking assemblies are evenly distributed in a circumferential directionwith the axis of the connecting pipe as a center; the executing assembly comprises a magnet disc, a first electromagnet, a connecting rod, a supporting ring, an auxiliary block and two first springs;and each locking assembly comprises a guide hole, a moving rod, a second spring, a rolling wheel and at least two second electromagnets. According to the wafer adsorption device with the anti-fallingfunction, the function that the suction nozzle adsorbs the wafer is achieved through the executing mechanism; in addition, the situation that the wafer falls off from the suction nozzle due to too large wind resistance in the process that the suction nozzle drives the wafer to move can be prevented through the auxiliary mechanism, so the stability of the device is improved.

Description

technical field [0001] The invention relates to the field of production and processing of integrated circuits, in particular to a chip adsorption device with a detachment prevention function. Background technique [0002] Integrated circuits, or microcircuits, microchips, and chips, are a way of miniaturizing circuits in electronics, and are usually manufactured on the surface of semiconductor wafers. Chip adsorption equipment is a type of chip packaging equipment, which is passed The suction nozzle absorbs the wafer on the wafer and moves it to the device on the substrate. [0003] During the working process of the existing wafer adsorption equipment, most of them use the electric vacuum system to reduce the air pressure in the suction nozzle to realize the function of the suction nozzle to absorb the wafer. When the electric vacuum adsorption fails, the power in the suction nozzle will be When the air pressure returns to atmospheric pressure, the suction nozzle cannot abs...

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Problems solved by technology

[0003] During the working process of the existing wafer adsorption equipment, most of them use the electric vacuum system to reduce the air pressure in the suction nozzle to realize the function of the suction nozzle to absorb the wafer. When the electric vacuum adsorption fails, the power in the suction nozzle will be When the air pressure returns to atmospheric pressure, the suction nozzle cannot absorb the wafer and the wafer will fall, causing losses and reducing the practicability. Not only that, in order to improve work efficiency, the suction nozzle absorbs the wafer at a faster translation speed, and the wafer is easy to fall from under the action of wind resistance. Falling off the nozzle reduces stability

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