Three-dimensional packaging component and manufacturing method of radio frequency microsystem with multi-level substrate stacking and vertical heat dissipation channels
A heat dissipation channel and three-dimensional packaging technology, which is applied in the direction of electrical components, semiconductor devices, electric solid devices, etc., can solve the problems of low thermal conductivity of glue filling and unsatisfactory vertical heat dissipation effect, so as to ensure the transmission effect and reduce the plane mounting The effect of space, total package volume, and thermal conductivity improvement
Active Publication Date: 2022-03-08
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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Problems solved by technology
The traditional method is to solve the problem of vertical heat dissipation by pouring glue inside the metal shell, but due to the low thermal conductivity of the glue, the vertical heat dissipation effect is not ideal
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[0062] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.
[0063] HTCC-based three-dimensional packaging technology for radio frequency microsystems will become an important direction for future development in the field of microsystem packaging. This application is a three-dimensional packaging component for radio frequency microsystems with multi-level substrate stacking and vertical heat dissipation channels 10 developed based on HTCC technology. The component structure adopts the form of ceramic packaging, including the shell, which is a double-sided cavity structure; the shell includes a ceramic base 3, and chambers are set on both sides of the ceramic base to form a double-sided cavity structure, and a number of c...
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Abstract
The invention relates to a radio frequency microsystem three-dimensional packaging assembly with multi-level substrate stacking and vertical heat dissipation channels and a manufacturing method, including a housing, which includes a ceramic base, and chambers are provided on both sides of the ceramic base to form a double-sided cavity structure. A number of ceramic substrates are embedded in each chamber, and a horizontal heat dissipation channel is formed between the two chambers; several layers of steps are set in the chamber, and the surface of each step is distributed with a BGA pad array structure, which is flat on both sides of the chamber end face facing the ground. Metal leads are drawn out, and metal frames are respectively erected at the opening ends of the two chambers; at least one cavity is respectively set up on the surface or bottom of the ceramic substrate, and the surface of the ceramic substrate is also provided with a BGA pad array structure, and the BGA pad surface on the surface of the ceramic substrate The array structure matches the BGA pad array structure located on the surface of the step; in the cavity of each ceramic base, a vertical heat dissipation channel is set along the end face of the step; the present invention has the characteristics of high integration, excellent microwave performance, and better heat dissipation performance .
Description
technical field [0001] The invention relates to a radio frequency microsystem three-dimensional packaging component with multi-level substrate stacking and vertical heat dissipation channels and a manufacturing method, belonging to the field of radio frequency microsystem packaging. Background technique [0002] RF microsystem components generally have two typical packaging forms; one is PCB with metal casing, which is less difficult to manufacture and is a relatively traditional packaging form. This kind of packaging form is generally large in size, which constitutes a bottleneck for the design and production of complex structures, and its application is limited. There are few applications at this stage; the other is currently the most commonly used low-temperature co-fired ceramic (LTCC) combined with aluminum-based composite metal materials. The shell and LTCC substrate have low dielectric loss and high hardness, which can meet complex wiring requirements and have the con...
Claims
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IPC IPC(8): H01L25/07H01L25/00H01L23/498H01L23/48H01L23/367H01L23/66
CPCH01L25/072H01L25/50H01L23/49816H01L23/49838H01L23/481H01L23/3672H01L23/66H01L2224/48227
Inventor 庞学满陈寰贝夏庆水
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD