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Spliced LED module packaging process

A technology of LED module and packaging process, applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems affecting the display effect of LED modules, image discontinuity, scratch resistance, poor wear resistance, etc., to achieve optimized display effect, Effects with removal of effects, image integrity

Pending Publication Date: 2021-04-09
深圳全息界科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the related technology, the light source in the LED display unit is exposed, and the scratch resistance and wear resistance are poor, and in the spliced ​​LED module,

Method used

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  • Spliced LED module packaging process
  • Spliced LED module packaging process

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Example Embodiment

[0024]Embodiments of the present invention will be described in detail below, and examples of the embodiments are illustrated in the drawings, in which the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions. The following is exemplary, and is intended to be used herein, not to be construed as limiting the invention.

[0025]In the description of the present invention, it is to be understood that the orientation or positional relationship of the orientation, such as upper, lower, prior, and then left, right, etc., is only based on the orientation or positional relationship shown in the drawing. In order to facilitate the description of the invention and simplified description, rather than indicating or implying that the device or element must have a particular orientation, it is not understood to be limited to the present invention.

[0026]In the description of the present invention, several meanings are more than one...

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Abstract

The invention discloses a spliced LED module packaging process. The spliced LED module packaging process comprises the following steps: splicing a plurality of LED display units to form an LED module; attaching a composite film to the LED module, wherein the composite film comprises an optical hot melt adhesive film and a functional film which are attached to each other; carrying out hot pressing on the LED module attached with the composite film; and curing LED module. According to the invention, the composite film comprising the optical hot melt adhesive film and the functional film is attached to the LED module, so that the abutted seam between the adjacent LED display units is filled with the optical hot melt adhesive film under the action of hot pressing so as to eliminate the influence of the abutted seam on the picture display of the LED module, the image displayed by the LED module is more complete, and the display effect of the LED module is optimized; and meanwhile, the functional film is bonded and fixed, and the functional film can protect the surface of the LED module, so that the LED module has scratch-resistant and wear-resistant functions.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a splicing LED module packaging process. Background technique [0002] The splicing LED module is composed of multiple LED display units. The LED display units can be displayed on a single screen or combined into corresponding shapes according to the needs of use. Adjacent LED display units are matched with each other through the interface and combined for display. In the related technology, the light source in the LED display unit is exposed, and the scratch resistance and wear resistance are poor, and in the spliced ​​LED module, there are seams between adjacent LED display units, resulting in the discontinuity of the image displayed by the LED module. Affect the display effect of the LED module. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the present invention prop...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/52H01L25/16
CPCH01L33/005H01L33/52H01L25/167
Inventor 陈波
Owner 深圳全息界科技有限公司
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