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Lead structure and forming method thereof

A technology of lead wire and shielding structure, which is applied in the connection of antenna grounding switch structure, the structure form of radiation element, antenna grounding device, etc. It can solve the problems of inaccurate positioning, attenuation of positioning accuracy with distance, and affecting the structural performance of lead wires, etc., and achieves improvement. The effect of accuracy

Active Publication Date: 2021-04-13
JIANGSU HUITONG GRP
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  • Description
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  • Application Information

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Problems solved by technology

[0003] The lead structure of the antenna on the current positioning main board is all arranged on the same layer on the printed circuit board (Printed Circuit Board, PCB). Although the two traces of the lead structure have been designed as parallel as possible, due to the The presence of other traces and vias on the lead structure will leave a gap between the two traces of the lead structure
When there is a magnetic field, due to the electromagnetic induction effect, it will affect the performance of the lead wire structure, resulting in inaccurate positioning or the attenuation of positioning accuracy with distance

Method used

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  • Lead structure and forming method thereof

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Embodiment Construction

[0039] On the existing positioning chip, there is a section of antenna lead structure between the chip and the external antenna base. The lead structure includes a first branch and a second branch, and one end of the first branch is connected to a lead on the positioning chip. pin, the other end of the first branch is connected to a pin of the external antenna base; one end of the second branch is connected to the other pin on the positioning chip, and the other end of the second branch is connected to the external antenna base another pin. figure 1 It is a schematic top view of the wiring structure and wiring of the antenna on the PCB substrate in the prior art (other traces, vias and devices on the PCB substrate are all shown in the figure). Such as figure 1 As shown, the first branch 1 and the second branch 2 of the lead structure of the antenna are arranged on the same layer of the PCB substrate 3 , and there is a gap between the first branch 1 and the second branch 2 of ...

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Abstract

The invention provides a lead structure and a forming method thereof. A carrier of the lead structure is a dielectric layer. The lead structure comprises a first branch and a second branch, and the first branch and the second branch are located on two different parallel horizontal planes respectively. The forming method of the lead structure comprises the following steps of forming a first branch of the lead structure on a first surface of the dielectric layer, and forming a second branch of the lead structure on the second surface of the dielectric layer, wherein the first surface and the second surface are different and parallel to each other.

Description

technical field [0001] The present invention relates to the technical field of antennas, in particular to a lead structure and a method for forming the lead structure. Background technique [0002] At present, with the continuous improvement of positioning technologies such as Bluetooth AOA (Activity-On-Arrow) and UWB (Ultra Wide Band), positioning services are applied in more and more scenarios, such as keyless start of cars, indoor positioning of supermarkets and shopping malls Wait. [0003] The lead structure of the antenna on the current positioning main board is all arranged on the same layer on the printed circuit board (Printed Circuit Board, PCB). Although the two traces of the lead structure have been designed as parallel as possible, due to the The presence of other traces and vias on the lead structure will leave a gap between the two traces of the lead structure. When a magnetic field is generated, due to the electromagnetic induction effect, it will affect th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/50H01Q1/38H01Q1/48
CPCH01Q1/50H01Q1/48H01Q1/38
Inventor 王莹龙涛
Owner JIANGSU HUITONG GRP