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A method of making a printed circuit board

A technology for printed circuit boards and manufacturing methods, which is applied in the directions of printed circuits, printed circuit manufacturing, and multilayer circuit manufacturing. The effect of improving precision and saving the cost of slotting process

Active Publication Date: 2022-08-05
WUXI SHENNAN CIRCUITS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method for manufacturing a printed circuit board to solve the problems existing in the prior art that the size, depth and stacking of stepped grooves are limited

Method used

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  • A method of making a printed circuit board
  • A method of making a printed circuit board
  • A method of making a printed circuit board

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Embodiment Construction

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] see figure 1 , figure 1 This is a schematic flow chart of an embodiment of a method for manufacturing a printed circuit board provided by the present invention. The method for manufacturing a printed circuit board in this embodiment includes the following steps:

[0021] S11: Obtain the plate to be processed.

[0022] With the continuous development of science and technology, the functions that printed circuit boards need to achieve are b...

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Abstract

The invention discloses a manufacturing method of a printed circuit board, which comprises: obtaining a plate to be processed; pasting a high-temperature adhesive tape on a predetermined position of the plate to be processed; browning treatment of the plate to be processed; and laser light of the plate to be processed The drilling spot is superimposed and ablated to make a stepped groove, wherein the predetermined position includes the groove bottom of the stepped groove; wherein, the processing parameters of the laser drill in the ablation groove edge area are different from the processing parameters in the groove area; The step groove of the printed circuit board is no longer limited by the laminated structure, step depth and step groove size, and its accuracy is improved, and the product sub-board layer and PP layer of this method do not need to be grooved, saving energy. The cost of the slotting process and the purchase cost of the gasket are calculated.

Description

technical field [0001] The invention relates to the technical field of manufacturing of multi-layer printed circuit boards, in particular to a manufacturing method of a printed circuit board with stepped groove design. Background technique [0002] With the continuous development of science and technology, printed circuit boards (PCB printed circuit boards) need to implement more and more functions, which leads to more and more complex structures of printed circuit boards. The circuit board was born. [0003] At present, the method of machining step grooves on printed circuit boards is mainly to use the method of depth control of gaskets for processing. First, the inner core board is slotted and the gasket resistance glue is placed, and then the outer layer is processed by depth-controlled milling. Open the cover to remove the gasket, and finally form a step groove. [0004] In the existing step groove processing method, due to the manual operation of the gasket and the ou...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/0026H05K3/0047H05K3/4611
Inventor 高德萌焦云峰
Owner WUXI SHENNAN CIRCUITS CO LTD