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Assembly device

A technology for assembling equipment and components, applied in metal processing equipment, metal processing, manufacturing tools, etc., can solve the problems of low assembly efficiency, uneven arrangement, inconsistent front and back, etc., to reduce scrap, improve assembly efficiency, and improve positioning The effect of precision

Active Publication Date: 2021-04-16
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the packaging method of such materials is simple, and the operation is difficult in the process of picking, placing and assembling, resulting in low assembly efficiency
In the related technology, the size of the sensor part of the TWS earphone is very small. During the assembly process of the TWS earphone, the sensor is placed on a layer of soft release paper, and the arrangement is uneven, and there is a phenomenon of inconsistency between the front and the back, resulting in the TWS earphone The assembly process must be equipped with huge human resources
At the same time, the size of the sensor is too small, and the sensor is easy to drop when the hand tool picks and places the sensor, resulting in serious scrapping of materials

Method used

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Embodiment Construction

[0060] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0061] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0062] At the same time,...

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PUM

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Abstract

The invention discloses an assembly device. The assembly device comprises a base body, a conveying assembly, a suction mechanism and a visual positioning mechanism, wherein the base body is provided with a mounting surface; the conveying assembly is arranged on the mounting surface and is provided with a conveying surface for conveying trays; the suction mechanism comprises a driving assembly arranged on the base body and a suction nozzle assembly connected with the driving assembly, and the driving assembly drives the suction nozzle assembly to be close to or far away from the conveying surface, so that the suction nozzle assembly adsorbs sensors of the trays; and the visual positioning mechanism comprises a primary positioning assembly and an upper visual guide assembly, the upper visual guide assembly is arranged on the driving assembly and electrically connected with the driving assembly, the suction nozzle assembly and the primary positioning assembly, and the primary positioning assembly is arranged on the base body, directly faces the conveying surface and is used for shooting the sensors in the trays on the conveying surface. The invention aims at providing the assembly device which can effectively prevent products from falling off and realize accurate positioning, the assembling efficiency is improved, and meanwhile, the scrapping of materials is reduced.

Description

technical field [0001] The invention relates to the technical field of sensor assembly equipment, in particular to an assembly equipment. Background technique [0002] With the popularity of miniaturized products such as TWS earphones and wearable products, the volume of components in such products is also getting smaller and smaller. At the same time, the packaging method of such materials is simple, and the operation is difficult in the process of picking, placing and assembling, resulting in low assembly efficiency. In related technologies, the size of the sensor part of the TWS earphone is very small. During the assembly process of the TWS earphone, the sensor is placed on a layer of soft release paper, and the arrangement is uneven, and there is a phenomenon of inconsistency between the front and the back, resulting in the TWS earphone The assembly process must be equipped with huge human resources. At the same time, the size of the sensor is too small, and the sensor...

Claims

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Application Information

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IPC IPC(8): B23P19/00
Inventor 马凯
Owner GOERTEK INC