Multi-node thermocouple transient heat flow sensor processing device
A heat flow sensor and processing device technology, applied in the direction of wire processing, other household appliances, household appliances, etc., can solve the problem of dislocation of wire distribution, and achieve the effect of preventing dislocation and facilitating wrapping processing.
Active Publication Date: 2021-04-20
INST OF MECHANICS - CHINESE ACAD OF SCI
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Problems solved by technology
[0005] The purpose of the present invention is to provide a multi-node thermocouple transient heat flow sensor processing device to solve the problem in the prior art that it is difficult to quickly change the distribution of each wire according to the type of sensor core, and the process of drawing multiple wires In the middle, it may cause the distribution state of each wire to be misaligned.
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[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0035] like Figure 1 to Figure 5 As shown, the present invention provides a multi-node thermocouple transient heat flow sensor processing device, including a multi-wire processing device 1 for wrapping wires, and a plurality of nickel wires for winding bare wires are installed on the multi-wire processing device 1 Chrome wire reel 2 and multiple constantan wire reels 3 for rolling enameled wires, multi-wire processing device 1 is equipped with outer layer wra...
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The invention discloses a multi-node thermocouple transient heat flow sensor processing device. The device comprises a multi-wire processing device body for wrapping wires, the multi-wire processing device body is provided with a plurality of nichrome wire coils for coiling bare wires and a plurality of constantan wire coils for coiling enameled wires, the multi-wire processing device body is provided with an outer layer wrapping device which is connected with the plurality of bare wires and enameled wires and wraps the outer sides of the plurality of bare wires and enameled wires, and the side of the multi-wire processing device is provided with a wire drawing device which is used for drawing the outer layer wrapping device to discharge and wrap a sensor structure. According to the multi-wire processing device, a multi-wire restraining mechanism is used for limiting, guiding and adjusting the bare wires on the plurality of nichrome wire coils and the enameled wires on the plurality of constantan wire coils, so that the wires guided by the multi-wire restraining mechanism are guided and restrained into the distribution shape of a sensor inner core needing to be machined so as to be suitable for subsequent machining of sensors.
Description
technical field [0001] The invention relates to the technical field of thermocouple transient heat flow sensors, in particular to a processing device for multi-node thermocouple transient heat flow sensors. Background technique [0002] The coaxial thermocouple transient heat flow sensor is an experimental component that uses the Seebeck effect of different electrode materials to form an electromotive force under different temperature gradients and measure it, and then inverts the temperature and heat flow. It is mainly used in aerospace hypersonic aircraft aerodynamics Experiments, hypersonic flow related experiments, etc., have the characteristics of fast response, large measurement range, high precision, and strong robustness. [0003] Thermocouple transient heat flow sensors can be divided into various types of cores according to different usage requirements. The core structure includes but not limited to five cores with single measuring point, four cores with single mea...
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IPC IPC(8): B21F23/00B21F45/00
Inventor 韩桂来姜宗林
Owner INST OF MECHANICS - CHINESE ACAD OF SCI