Check patentability & draft patents in minutes with Patsnap Eureka AI!

High power surface mount filter

A filter, top surface technology, used in waveguide-type devices, cooling/ventilation/heating retrofits, power electronics modifications, etc., can solve problems such as reducing power handling capacity

Active Publication Date: 2021-04-20
KYOCERA AVX COMPONENTS CORP (N D GES D STAATES DELAWARE)
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, miniaturization of passive components often undesirably reduces power handling capacity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High power surface mount filter
  • High power surface mount filter
  • High power surface mount filter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] Those of ordinary skill in the art will appreciate that the present discussion is a description of exemplary embodiments only, and is not intended to limit the broader aspects of the disclosure, which are implemented as exemplary configurations.

[0035] In general, the present disclosure relates to a filter assembly having excellent heat dissipation capabilities. The filter assembly may include a monolithic filter having a generally planar surface and a heat sink coupled to the generally planar surface of the monolithic filter. The heat sink may comprise a layer of thermally conductive material having a thickness greater than about 0.02 mm.

[0036] The layer of thermally conductive material facilitates heat flow away from the monolithic filter, which allows the monolithic filter to operate at higher power levels without overheating. Current flowing through the monolithic filter generates heat, which may undesirably overheat the filter components. By improving heat d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
lengthaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.

Description

[0001] Cross References to Related Applications [0002] This application claims the filing right of U.S. Provisional Patent Application No. 62 / 732,605, filed September 18, 2018, which is hereby incorporated by reference in its entirety. Background technique [0003] Electrical filters perform many functions and are used in a variety of electrical devices. The trend towards miniaturization has increased the need for smaller passive components. However, miniaturization of passive components often undesirably reduces power handling capacity. Compact filter assemblies capable of operating at increased power levels would be welcome in the art. Contents of the invention [0004] According to one embodiment of the present disclosure, a filter assembly may include a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink may comprise a layer of thermally conductive material having a thickness greater than about 0.02mm. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01P11/00H01P1/30H01P1/203
CPCH03H2001/0078H03H2001/0085H03H7/0115H03H7/175H03H7/1775H03H7/54H05K7/20918H05K9/0071H03H7/0161
Inventor K.崔M.贝罗利尼M.W.柯克H.富恩特斯J.C.赫尔B.R.塞瑟
Owner KYOCERA AVX COMPONENTS CORP (N D GES D STAATES DELAWARE)
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com