Multi-chip mounting structure and preparation method thereof

Abstract

The invention provides a multi-chip mounting structure and a preparation method, and the preparation method comprises the steps: mounting a plurality of chips on a substrate, preparing a filling auxiliary layer on the chips to form a cavity, forming a gas inlet and a gas outlet corresponding to the cavity, coating the gas inlet with a primer filling material, and applying a negative pressure at the gas outlet; enabling the primer filling material to flow into the bottoms of the chips based on the air pressure to form underfill. For a packaging structure of a plurality of chip modules, the cavity is constructed between a to-be-packaged chip and a substrate, the primer filling material is coated at the gas inlet, and negative pressure is applied at the gas outlet, so that the underfill is pressed into the bottoms of the chips under the action of gas pressure, the filling difficulty of the underfill of the multi-chip structure can be reduced, and the problem of filling bubbles is favorably solved. And the problems that in a multi-chip small-spacing structure, the glue filling head is difficult to place, the glue filling process is complex, and the influence on the structure of the previous step is large can be solved. The process is simple, and the problem that filling is performed as required when a plurality of chips are difficult to integrate can be solved.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a mounting chip structure and a preparation method for the mounting chip structure. Background technique [0002] The bottom mounting technology of the chip is the main way for the chip to be connected to the terminal. In order to prevent the large stress difference between the chip and the substrate from causing the solder balls to break, it is often necessary to fill the bottom glue between the chip and the substrate. [0003] However, with the development of technology, the number of chips has increased and the size has become larger, and the number of chips mounted on the surface of the current module is large. At present, in the prior art, it is difficult to perform bottom filling according to actually needed chips among multiple chips, and not to fill unnecessary chips. In addition, it is very difficult for the underfill to completely occupy the space at...

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a chip mount structure and a method for preparing the chip mount structure, which are used to solve the problem of the difficulty in forming an effective underfill at the bottom of a multi-chip structure in the prior art. The packaging structure of the chip integration is difficult to fill, the process is complicated, the influence between steps is large, and it is difficult to effectively realize on-demand filling.

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