No-drilling-dirt base plate composite device for high-precision positioning electronic circuit board

A technology of electronic circuit boards and composite devices, which is applied in the direction of printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as burns on circuit boards, limited processing efficiency of composite devices, and affect device processing efficiency, and achieve the effect of improving processing efficiency

Active Publication Date: 2021-04-27
JIANGYIN HUCHENG INSULATING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, when laminating non-drilled backing boards with other boards of circuit boards, it is usually necessary to manually put the stacked circuit boards into a high-temperature furnace one by one for fusion, and only when a group of circuit boards are fused And after taking out, the next group of circuit boards can be put into the high-temperature furnace for fusion, resulting in very limited processing efficiency of the composite device; out of the middle, its surface temperature is high, and the operator may be scalded by the circuit board if he is not careful, and it is impossible to cool down the processed circuit board without affecting the processing efficiency of the device; at the same time, the current composite device is being completed. After the circuit boards are fused, it is often difficult for the operator to quickly remove the processed circuit boards manually for replacement, which easily affects the processing efficiency of the entire device

Method used

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  • No-drilling-dirt base plate composite device for high-precision positioning electronic circuit board
  • No-drilling-dirt base plate composite device for high-precision positioning electronic circuit board
  • No-drilling-dirt base plate composite device for high-precision positioning electronic circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Example 1, such as Figure 1-6 As shown, when processing circuit boards, multiple groups of circuit boards and non-drilled backing plates are stacked on top of the placement board 13 in sequence, and the four sets of limit pins 14 on the top of the placement board 13 are inserted into the corresponding boards. In the limit hole on the top, so that the circuit boards are stacked orderly and neatly on the top of the placement plate 13, and then the first servo motor 9 is controlled to rotate one circle through the control panel 19, and the first servo motor 9 only rotates once at a time. circle, so that the rotating tube 7 and the turntable 10 rotate 90° clockwise, so that the circuit boards that have just been stacked are moved to the right below the second mounting seat 186, and the stacked circuit boards are moved to the first mounting seat 185. When directly below, control two groups of electric elevating rods 184 to elongate, let the bottom of the second mounting bas...

Embodiment 2

[0043] Example 2, such as figure 1 , 2 , 3, 4, 5 and 7, when the processed circuit board needs to be removed, the second servo motor 112 is controlled to rotate clockwise, and the lifting plate 114 is forced to rise gradually due to the external thread of the threaded rod 111. The four sets of ejector pins 113 are raised, and the ejector pins 113 pass through the through holes 116 on the turntable 10 and the placement plate 13 to lift the circuit boards on the placement board 13, so that the operator removes the circuit boards that have been fused, and The second servo motor 112 is controlled to rotate counterclockwise, so that the four sets of push rods 113 descend to their original positions.

[0044] Working principle: Connect the device to the power supply before use, first stack multiple sets of circuit boards and non-drilling backing boards on the top of the placement board 13 in sequence, and insert the four sets of limit pins 14 on the top of the placement board 13 in...

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PUM

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Abstract

The invention discloses a no-drilling-dirt base plate composite device for a high-precision positioning electronic circuit board. The device comprises an installation platform, a semicircular cabin is installed at one end of the top of the installation platform, a second bearing is installed at the central position of the bottom of the installation platform, a rotating pipe is installed at the inner side of the second bearing, a rotating disc is installed at the top end of the rotating pipe, a large gear is mounted at the bottom of the outer side of the rotating pipe, a first servo motor is mounted in the middle of the bottom of the mounting table, and a small gear engaged with the large gear is mounted at the output end of the first servo motor. Through cooperative use of the large gear, the first servo motor, the rotating disc, rolling wheels, a containing plate, limiting pins, the small gear, a composite assembly, connecting rods and partition plates, the whole device can conduct machining treatment on the circuit board all the time, no too long interval exists in the process, and therefore the machining efficiency of the whole composite device is greatly improved.

Description

technical field [0001] The invention relates to the technical field of electronic circuit board processing, in particular to a non-drilling dirty backing plate composite device for high-precision positioning electronic circuit boards. Background technique [0002] In the past ten years, my country's circuit board manufacturing industry has developed rapidly, and its total output value and total output both rank first in the world. Circuit boards have developed from single-layer to double-sided boards, multi-layer boards and flexible boards. To develop in the direction of high density and high reliability, multilayer circuit boards are inseparable from the corresponding composite device to composite multiple groups of circuit board layers of the circuit board into a whole. [0003] At present, when laminating non-drilled backing boards with other boards of circuit boards, it is usually necessary to manually put the stacked circuit boards into a high-temperature furnace one by ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/00
Inventor 赵亦初王建平
Owner JIANGYIN HUCHENG INSULATING MATERIAL
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