Current-assisted SPF/DB integrated forming process

A forming process and current technology, applied in the field of current-assisted SPF/DB integrated forming process, can solve problems such as large total current requirements

Active Publication Date: 2021-04-30
NANYANG NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the rapid prototyping device for titanium alloy multilayer plates and its forming method can realize the diffusion connection and superplastic forming of titanium alloy multilayer plates, when the plate is heated by a power supply, the current is conducted to the graphite through the graphite...

Method used

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  • Current-assisted SPF/DB integrated forming process
  • Current-assisted SPF/DB integrated forming process
  • Current-assisted SPF/DB integrated forming process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Such as Figure 1-9 As shown, a current-assisted SPF / DB integrated forming mold, the mold includes an insulating mold body 1, and the insulating mold body 1 is provided with a cavity 3 and an assembly hole 2, and the assembly hole 2 is set through the cavity 3 , the assembly hole 2 is equipped with a vertical electrode 4, and the vertical electrode 4 is assembled in the assembly hole 2 and divides the cavity 3 into at least one cavity 5 for sheet material 6 molding (such as Figure 9 As shown, after the vertical electrode 4 is inserted into the assembly hole 2, the inclined surface 41 at the bottom of the vertical electrode 4 ("inclined surface" refers to the outer peripheral surface of the part where the vertical electrode 4 is located in the concave cavity range and the bottom surface of the plate in the present invention) The shape does not constitute a limitation, and is replaced by "inclined surface" in this embodiment only for the convenience of description; in ac...

Embodiment 2

[0066] On the basis of embodiment 1, the part (the inclined surface 41 at the bottom of the vertical electrode) constituting the boundary of the mold cavity 3 on the vertical electrode 4 is an insulating surface, and the insulating surface is coated with an insulating material ( It can be made of high-temperature-resistant insulating materials such as insulating varnish, which are easy to paint, have small thickness and easy control of uniformity, etc.). By coating the insulating material on the inclined surface 41 at the bottom of the vertical electrode constituting the cavity 3, the current when the vertical electrode is energized can be effectively concentrated on the area covered by the bottom surface 42 of the vertical electrode, thereby realizing the diffusion connection of the current in the plate Concentration of regions speeds up the process of diffusion connection of regions to be diffused and connected. Wherein, the material of the insulating mold main body 1 can be...

Embodiment 3

[0068] On the basis of Embodiment 2, the side on the vertical electrode 4 that is used to bond with the plate 6 and electrically heat the area to be diffused and connected to the plate 6 is a heating surface (bottom surface 42 of the vertical electrode in the figure), and the insulating surface is provided with 2 and set on both sides of the heating surface. By respectively setting insulating surfaces (inclined surfaces 41 at the bottom of the vertical electrodes) on both sides of the bottom surface 42 of the vertical electrodes, after the vertical electrodes 4 are assembled in the assembly holes 2, the inclined surfaces 41 on both sides can cooperate with the cavity 3, as The boundary of the cavity 5 used for sheet forming is further applicable to the processing of sheets that need to form multiple hollow structures, improving the efficiency of sheet processing.

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Abstract

The invention belongs to the technical field of current-assisted thermoforming of light-weight high-strength structures, and particularly relates to a current-assisted SPF/DB integrated forming process. According to the integrated forming process, an integrated forming die is adopted for achieving forming of a plate; the die comprises an insulating die body; the insulating die body is provided with a concave cavity and an assembling hole; the assembling hole penetrates through the concave cavity; a vertical electrode is assembled at the assembling hole; the vertical electrode is assembled in the assembling hole and then divides the concave cavity into at least one cavity used for plate forming; and the end face of the end, close to the open end of the concave cavity, of the vertical electrode is used for being attached to a plate so as to be used for electrically heating the area, to be subjected to diffusion connection, of the plate. According to the current-assisted SPF/DB integrated forming process provided by the invention, the temperature of a contact area can be increased, the deformation resistance of the contact area is reduced, healing elimination of interface holes is accelerated by utilizing a current crack healing effect, interface element diffusion is promoted, and low-pressure and short-time rapid diffusion connection of the composite interface can be realized.

Description

technical field [0001] The invention belongs to the technical field of current-assisted thermoforming of light weight and high-strength structures, and in particular relates to a current-assisted SPF / DB integrated forming process. Background technique [0002] With the in-depth development of my country's aerospace technology, the new generation of high-tech equipment requires higher flight speed and longer flight distance, and puts forward higher requirements in terms of double weight reduction of high-temperature resistant lightweight structural materials and lightweight structures. Therefore, the development of lightweight structures with high-temperature-resistant lightweight materials is in line with the future development trend, and the demand is very urgent. [0003] Titanium-aluminum intermetallic compound has the characteristics of low density, high specific strength and good oxidation resistance. It is one of the light-weight high-temperature metal structural mater...

Claims

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Application Information

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IPC IPC(8): B21D37/10B21D37/16
CPCB21D37/10B21D37/16
Inventor 杜志豪魏欣裴玺韩建超马世榜
Owner NANYANG NORMAL UNIV
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