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Method for preparing circuit board and circuit board

A circuit board and breathable board technology, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problems of circuit board deformation, plug hole is not full, plug hole empty, etc., to ensure smoothness, plug hole full, plugged Hole leveling effect

Active Publication Date: 2022-06-21
HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The general tools for resin plug hole production include plug hole aluminum sheet screen, breathable plate and scraper. The scraper squeezes and scrapes the resin into the hole to make it full, but the breathable plate is needed to give air flow space, so the breathable plate is the resin plugging process. A necessary auxiliary tool, but during the drilling process of the existing air-permeable board, the slightly denser parts will fall off and form holes. The larger these holes are, the circuit board will be deformed when using a scraper to make resin plug holes. The problem gets worse, leading to problems with plug holes, underfilled plug holes, and plug hole blistering

Method used

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  • Method for preparing circuit board and circuit board
  • Method for preparing circuit board and circuit board

Examples

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preparation example Construction

[0034] The present application provides a method for preparing a circuit board. The method for preparing a circuit board includes the following steps: making a ventilating board, and setting an island area on the ventilating board; placing a circuit board to be plugged on the ventilating board; The circuit board to be plugged is in contact with the island area; the aluminum sheet is bonded to the bottom layer of the screen to obtain an aluminum sheet mesh with windows; the aluminum sheet mesh is placed on the circuit board to be plugged ; Set the opening to the hole to be plugged, and the hole to be plugged is set to the air guide between the island areas; scrape the copper paste covered on the aluminum mesh to the opening , pour the copper paste into the hole to be plugged through the window; plug the resin plug into the hole to be plugged on the circuit board through the aluminum mesh; put the copper paste in the circuit board Carry out curing treatment.

[0035] The above-...

Embodiment 1

[0094] Select a ventilation board with a thickness of 2.0mm, and the length of the ventilation board is 30mm larger than that of the circuit board to be plugged, and the width of the ventilation board is 30mm larger than that of the circuit board to be plugged. Carry out controlled depth drilling operation on the ventilating plate to obtain an island area on the ventilating plate. Place the circuit board to be plugged on the ventilation plate so that the circuit board to be plugged abuts against the island area. The aluminum sheet is bonded to the bottom layer of the screen to obtain an aluminum sheet mesh with windows, and then the aluminum sheet mesh is placed on the circuit board to be plugged. Set the opening window facing the hole to be plugged, and set the plug hole facing the air guide between the island areas. Scrape the copper paste covered with the aluminum mesh into the opening window, so that the copper paste is poured into the hole to be plugged through the openin...

Embodiment 2

[0096] Select a ventilation board with a thickness of 2.5mm, and the length of the ventilation board is 50mm larger than that of the circuit board to be plugged, and the width of the ventilation board is 50mm larger than that of the circuit board to be plugged. Carry out controlled depth drilling operation on the ventilating plate to obtain an island area on the ventilating plate. Place the circuit board to be plugged on the ventilation plate so that the circuit board to be plugged abuts against the island area. The aluminum sheet is bonded to the bottom layer of the screen to obtain an aluminum sheet mesh with windows, and then the aluminum sheet mesh is placed on the circuit board to be plugged. Set the opening window facing the hole to be plugged, and set the plug hole facing the air guide between the island areas. Scrape the copper paste covered with the aluminum mesh into the opening window, so that the copper paste is poured into the hole to be plugged through the openin...

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PUM

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Abstract

The application provides a method for preparing a circuit board and the circuit board. The preparation method of the above-mentioned circuit board comprises the following steps: making a ventilating board, and setting an island area on the venting board; Connect to the bottom layer of the screen plate to obtain an aluminum mesh with a window; place the aluminum mesh on the circuit board of the hole to be plugged; set the window facing the hole to be plugged, and the hole to be plugged is facing the air guide between the island areas Setting; scrape the copper paste covered in the aluminum mesh into the window, and pour the copper paste into the hole to be plugged through the window; insert the resin plug into the hole to be plugged in the circuit board through the aluminum mesh; insert the circuit The copper paste in the board is cured. The preparation method of the above-mentioned circuit board can make the plug hole smooth and free of bubbles, and can ensure that the circuit board will not be deformed during the resin plug hole manufacturing process.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for preparing a circuit board and a circuit board. Background technique [0002] With the development of miniaturization of assembly components, the wiring area and pattern design area of ​​circuit boards are also continuously reduced. In order to adapt to this development trend, circuit board designers and manufacturers are constantly updating the design concepts and production methods. The process of resin plug hole is also a technical method invented by people to reduce the design size of the circuit board and assemble components. Its bold design concept and large-scale production have indeed played a great impetus in the field of circuit board production, effectively improving the reliability and production process capabilities of products such as HDI, thick copper, and backplanes. Understanding and effectively using this technology is a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40H05K3/00
CPCH05K3/4038H05K3/0094H05K2201/095
Inventor 许校彬肖尊民
Owner HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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