Heat dissipation device and detection method thereof

A cooling device and heat sink technology, applied in the direction of measuring devices, measuring electricity, measuring electrical variables, etc., can solve problems such as wrong drive control, cold chip failure, electronic component failure, etc., and achieve the effect of improving work efficiency

Active Publication Date: 2021-05-07
CORETRONIC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the cooling chip is composed of a plurality of diodes connected in series, when the electronic device uses the cooling chip as the heat sink, the contact surface of the cooling chip may be damaged during the assembly process of the electronic device. It will be subjected to uneven pressure, which will cause the PN junction of these diodes to be destroyed, which will cause problems such as failure of the cooling chip or wrong drive control, and cause the electronic components to be dissipated because they cannot be cooled. fail

Method used

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  • Heat dissipation device and detection method thereof
  • Heat dissipation device and detection method thereof
  • Heat dissipation device and detection method thereof

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Embodiment Construction

[0056] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or back, etc., are only referring to the directions of the drawings. Accordingly, the directional terms are used to illustrate and not to limit the invention.

[0057] figure 1 is a schematic block diagram of the heat sink 100 according to the first embodiment of the present invention. Please refer to figure 1 , in this embodiment, the cooling device 100 includes a controller 110 , a driver 120 , a temperature sensor 130 , a heat sink 140 and a power supply 150 . The temperature sensor 130 may receive a reference temperature value TREF, and generate a temperature sensing signal TS according to the reference temperature value TREF. Wherein, th...

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Abstract

The invention discloses a heat dissipation device and a detection method thereof. The heat dissipation device comprises a controller, a driver, a temperature sensor and a heat dissipation device. The temperature sensor generates a temperature sensing signal according to a reference temperature value. The controller generates a control signal according to the temperature sensing signal. The driver generates a driving signal having a direct current portion and an alternating current portion according to the control signal. The heat dissipation device generates a feedback signal according to the driving signal. The controller calculates the impedance of the heat dissipation device according to a to-be-detected signal, and obtains a heat dissipation state signal according to the impedance of the heat dissipation device. According to the heat dissipation device and the detection method thereof, the health state of the radiator can be monitored in real time.

Description

technical field [0001] The present invention relates to a heat dissipation device and a detection method thereof, and in particular to a heat dissipation device capable of monitoring the health state of a radiator and a detection method thereof in real time. Background technique [0002] With the development of the technology industry, electronic devices such as projectors, notebook computers (Notebook, NB), tablet computers (Tablet PC) and smart phones (Smart Phone) have been popularized in the consumer market. With the continuous improvement of the operating performance of the electronic device, the heating power of the electronic components in the electronic device is also continuously increased. [0003] In this case, known technologies generally provide heat sinks (eg, thermoelectric coolers (TECs), fans or fins, etc.) in electronic devices to dissipate heat from electronic components that generate heat. However, since the cooling chip is composed of a plurality of dio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R27/08G01R31/00
CPCG01R27/08G01R31/003
Inventor 彭致勋蔡德颖
Owner CORETRONIC
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