Semiconductor power module and packaging method of semiconductor power module
A technology for power modules and semiconductors, which is applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, and semiconductor/solid-state device components, etc., and can solve the problems of large size of power modules and inability to meet application requirements.
Pending Publication Date: 2021-05-11
GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD
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Problems solved by technology
However, the power module in the prior art has a large volume and cannot meet higher application requirements
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[0041] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only the technical solutions of the present invention. Some, but not all, embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.
[0042] In the description of the present invention, unless otherwise clearly stipulated and limited, the terms "connected" and "fixed" should be understood in a broad sense, for example, it can be fixed connection, detachable connection or integration; it can be mechanical connection , can also be an electrical connection; it can be a direct connection...
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The invention discloses a semiconductor power module and a packaging method of the semiconductor power module. The semiconductor power module comprises a wafer carrier; a first wafer, the bottom surface of the first wafer being bonded to the top surface of the wafer carrier through a first bonding layer; the bottom surface of the first wafer being provided with a first bottom electrode, and the first bottom electrode being electrically connected with the wafer carrier; a conductive column being arranged in the first wafer, one end of the conductive column being electrically connected with the first bottom electrode, and the other end of the conductive column being exposed from the top surface of the first wafer; a second wafer, the bottom surface of the second wafer being bonded to the top surface of the first wafer through a second bonding layer; a second bottom electrode being arranged on the bottom surface of the second wafer; the second bottom electrode being electrically connected with the first bottom electrode through the conductive column. The packaging method is used for packaging the semiconductor power module. According to the semiconductor power module and the packaging method of the semiconductor power module, wafers with different functions are packaged in a stacked mode, electrical interconnection between the wafers is achieved, meanwhile, the product size is reduced, and higher application requirements can be met.
Description
technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor power module and a packaging method for the semiconductor power module. Background technique [0002] In existing semiconductor power modules, two or more chips are generally soldered on a chip carrier, and then the electrodes of the chips are electrically interconnected through metal wires to meet the functional design requirements of the power module. The smaller the volume of semiconductor packaging products (such as semiconductor power modules), when applied to electronic products, the density and integration of devices in electronic products can be improved. However, the power module in the prior art has a large volume and cannot meet higher application requirements. Contents of the invention [0003] An object of the embodiments of the present invention is to provide a semiconductor power module, which realizes chip stack packaging and red...
Claims
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Login to View More IPC IPC(8): H01L23/538H01L21/768
CPCH01L23/5386H01L23/5384H01L21/76895H01L21/76898
Inventor 王琇如唐和明
Owner GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD