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Printed circuit board and preparation method

A technology for printed circuit boards and core boards, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of low production efficiency of printed circuit boards, and achieve the advantages of avoiding lamination process, low cost and simple process Effect

Pending Publication Date: 2022-07-01
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above defects or improvement needs of the prior art, the present invention provides a printed circuit board and its preparation method, the purpose of which is to improve the preparation efficiency of the printed circuit board, thereby solving the technical problem of low production efficiency of the printed circuit board

Method used

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  • Printed circuit board and preparation method
  • Printed circuit board and preparation method

Examples

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preparation example Construction

[0057] figure 2 It is a method flow chart of a method for preparing a printed circuit board provided by an embodiment of the present invention, such as figure 2 As shown, the preparation method includes:

[0058] S201 , machining through holes 11 on the core board 1 that are compatible with the ceramic blocks 4 .

[0059] S202 , placing the ceramic block 4 at the center of the through hole 11 .

[0060] In the above-mentioned embodiment, the heat dissipation to the printed circuit board is realized by the ceramic block 4 .

[0061]S203. Fill the gap between the inner wall of the through hole 11 and the outer wall of the ceramic block 4 with the filling layer 3 through the glue bonding process, the solder paste welding process or the electroplating metal process (see image 3 and Figure 4 ).

[0062] In arrangement S203, the filling layer 3 is one of glue, solder paste and electroplated metal.

[0063] In the present embodiment, a, glue bonding process, including:

[...

Embodiment 1

[0089] Embodiment 1: Adopt glue bonding process to prepare the printed circuit board embedded with ceramic block 4, the specific technological process is as follows Image 6 shown:

[0090] (1) Select an alumina ceramic block 4 with a thickness of 0.5mm, and use laser processing to form a square piece with a side length of 1.0mm.

[0091] (2) The core board 1 (FR-4) with a thickness of 0.51mm is selected, and a square through hole 11 with a side length of 1.2mm is machined.

[0092] (3) Place the ceramic block 4 in the through hole 11 of the core board 1 to ensure that the gap between the outer wall of the ceramic block 4 and the inner wall of the through hole 11 is less than 0.2 mm.

[0093] (4) Select high temperature resistant organic adhesive (HE200, curing temperature is 100°C, glass transition temperature of cured body is 260°C), and evenly coat the high temperature resistant organic adhesive in the gap until it is filled.

[0094] (5) Heating and curing the high-tempe...

Embodiment 2

[0098] Embodiment 2: The printed circuit board with the embedded ceramic block 4 is prepared by using the solder paste welding process, and the specific technological process is as follows Figure 7 shown:

[0099] (1) Select an aluminum nitride ceramic block 4 with a thickness of 2.0mm, and use a laser to process it into a wafer with a diameter of 5.0mm.

[0100] (2) The core board 1 (FR-4) with a thickness of 2.02 mm is selected, and a circular through hole 11 with a diameter of 5.2 mm is machined.

[0101] (3) The inner wall of the through hole 11 and the outer wall of the ceramic block 4 are metallized (eg, electroplating to obtain the metal connection layer 7).

[0102] (4) Place the ceramic block 4 in the through hole 11 to ensure that the gap between the outer wall of the ceramic block 4 and the inner wall of the through hole 11 is not greater than 0.1 mm.

[0103] (5) Select metal solder paste with a melting point of 260°C and fill it into the gap until it is filled....

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Abstract

The invention discloses a printed circuit board and a preparation method, and belongs to the technical field of printed circuit boards. The printed circuit board comprises a core board and a metal circuit layer, a through hole is formed in the core board, a filling layer and a ceramic block are inserted in the through hole, the gap between the inner wall of the through hole and the outer wall of the ceramic block is filled with the filling layer, and the filling layer is one of an adhesive layer and a metal layer; wherein when the filling layer is an adhesive layer, the adhesive layer is arranged in the gap in a bonding mode, and when the filling layer is a metal layer, the metal layer is arranged in the gap in a welding or electroplating mode. According to the printed circuit board, the filling layer is arranged, and the filling layer realizes filling of the gap between the core board and the ceramic block in a bonding, welding or electroplating manner, so that fixation of the core board and the ceramic block is conveniently realized, use of a complex and low-efficiency pressing process is avoided, and the preparation efficiency of the printed circuit board is improved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and more particularly, relates to a printed circuit board and a preparation method. Background technique [0002] Circuit board, because it is made by electronic printing technology, is called printed circuit board. It is an important electronic component, a support body for electronic components, and a carrier for electrical connection of electronic components. After the electronic equipment adopts the printed board, due to the consistency of the same type of printed board, the error of manual wiring is avoided, and the quality of the electronic equipment can be guaranteed. [0003] In the related art, in order to increase the heat dissipation performance of the printed circuit board, the ceramic block is usually embedded in the printed circuit board. Specifically, after the ceramic block is embedded in the core board, the prepreg (resin) is pressed to the ceramic block by a press...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18H05K3/00H05K1/02
CPCH05K3/18H05K3/0011H05K1/0203
Inventor 陈明祥陈方康王卿
Owner HUAZHONG UNIV OF SCI & TECH