MEMS packaging structure and manufacturing method thereof

Abstract

The invention provides an MEMS packaging structure and a manufacturing method thereof. The MEMS packaging structure comprises an MEMS chip and a device wafer, a control unit and an interconnection structure are arranged in the device wafer. The first joint surface of the device wafer is provided with a first contact pad and an input and output connecting piece, the MEMS chip is bonded to the firstbonding surface through the bonding layer, the MEMS chip is provided with a closed micro-cavity and second contact pads, the first contact pads are electrically connected with the corresponding second contact pads, an opening is formed in the bonding layer, and the input and output connecting piece is exposed out of the opening. According to the MEMS packaging structure, electrical interconnection of the MEMS chip and the device wafer is achieved; and compared with an existing integration method, the method is advantageous in that the size of the packaging structure can be reduced, various MEMS chips can be integrated on the same device wafer, and the function integration capacity of the packaging structure can be improved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a MEMS packaging structure and a manufacturing method thereof. Background technique [0002] With the development trend of very large scale integrated circuits, the feature size of integrated circuits continues to decrease, and people's requirements for packaging technology of integrated circuits continue to increase accordingly. In the market for sensor-like MEMS packaging structures, microelectromechanical systems (MEMS) chips are widely used in product fields such as smartphones, fitness bracelets, printers, automobiles, drones, and VR / AR head-mounted devices. Commonly used MEMS chips include pressure sensors, accelerometers, gyroscopes, MEMS microphones, light sensors, catalytic sensors, and so on. MEMS chips are usually integrated with other chips by using a system in package (SIP) to form a MEMS device. Specifically, the MEMS chip is usually fabricated on one wafer, and the ...

AI Technical Summary

Problems solved by technology

[0003] However, for the MEMS device prepared by the above-mentioned former integration method, a pad area needs to be reserved on the packaging substrate, which usually has a large size, which is not conducive to the reduction of the overall device.

In addition, due to the large difference in the manufacturing process of MEMS chips with different functions (or structures), usually only MEMS chips with one function (or structure) can be produced on the same wafer, and it is difficult to use the latter integration method above on the same wafer. The semiconductor process is used to form MEMS chips with multiple functions on the wafer, and if the MEMS chip wafers with different functions are integrated on different control wafers for multiple times and then interconnected, the process is complicated and the cost is high, and the obtained MEMS Device size is still large

Therefore, the existing methods for integrating MEMS chips and the resulting MEMS packaging structures still cannot meet the requirements for size and functional integration capabilities in practical applications.

Images