Infrared temperature sensor packaging structure based on through hole interconnection and packaging method

Abstract

The invention belongs to the technical field of electronic machinery, and specifically relates to an infrared temperature sensor packaging structure based on through hole interconnection and a packaging method. The infrared temperature sensor packaging structure comprises a tube shell base, an infrared temperature sensor body, a metal pressure welding block and a substrate. A metal pin is arrangedon the tube shell base. The substrate is arranged on the tube shell base. A through hole is etched in the substrate. The infrared temperature sensor is arranged on the front surface of the substrate.The through hole is close to the output end of the infrared temperature sensor. A metal conductor is arranged in the through hole, the metal pressure welding block is located on the back face of thesubstrate and arranged on the periphery of the through hole, the output end of the infrared temperature sensor is in electric contact with the through hole, the metal pressure welding block is in electric contact with the metal conductor, and the metal pressure welding block is in electric contact with the metal pin. The packaging structure is small in size, and bonding wires do not need to be arranged for electric connection.

Description

technical field [0001] The invention belongs to the technical field of electromechanics, and in particular relates to an infrared temperature sensor packaging structure and packaging method based on through-hole interconnection. Background technique [0002] Infrared temperature sensor is a non-contact temperature measurement method. With the improvement of social life and the development of science and technology, infrared temperature sensors are more and more widely used in the fields of intelligent medical treatment and health monitoring. For example, it is the core component of forehead temperature gun. Miniaturization is the general trend of this kind of sensor products. With the help of the powerful processing platform of the microelectronics process, the chip size of the infrared sensor is getting smaller and smaller, so how to package becomes the main bottleneck of the miniaturization of the sensor product. [0003] At present, the package of the infrared temperatu...

AI Technical Summary

Problems solved by technology

Since the bonding wire has a certain cross-arc height and length, the packaged sensor will be larger in size, especially in the vertical direction. Generally, the cap height of the packaged sensor is greater than 2.5mm

This is difficult to meet the growing demand for 1-2mm thickness of packaged sensors in the fields of wearable, smart medical and health monitoring

In addition, the use of bonding wires will cause additional resistance, capacitance and inductance issues

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