High-temperature testing device and testing method for integrated chip

A technology of a test device and a test method, applied in the field of testing, can solve the problems of inconvenient experimental operation, low test accuracy, long test time, etc., and achieve the effects of improving the test environment temperature, simple connection structure, and small current fluctuation

Pending Publication Date: 2021-05-21
SG MICRO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] When the above two methods of testing the high temperature characteristics of integrated chips are used, the test takes a long time, the cost is high, the efficiency is low, the test accuracy is not high, and the experimental operation is inconvenient, which has certain risks.

Method used

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  • High-temperature testing device and testing method for integrated chip

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Embodiment Construction

[0036] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be implemented in different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0038] Hereinafter, the present invention will be described in detail with reference t...

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Abstract

The invention discloses a high-temperature testing device and method for an integrated chip, and the method comprises the steps: inputting a heating current to an idle pin of a to-be-tested chip, so as to improve the testing temperature of the to-be-tested chip; determining whether the test temperature of the to-be-tested chip reaches a target temperature; and when the test temperature of the to-be-tested chip reaches the target temperature, performing parameter or performance test on the to-be-tested chip by using the test machine. The high-temperature test of the integrated chip can be realized on a general test board at normal temperature, the requirement on equipment is low, and the operation is simple.

Description

technical field [0001] The invention relates to the technical field of testing, in particular to a high-temperature testing device and testing method for an integrated chip. Background technique [0002] With the enhancement of integrated chip functions and the continuous expansion of integration scale, chip testing has become more and more difficult, and the testing cost is often higher than the design cost. The testing cost has become an important part of the product development cost. The length of testing time It also directly affects the time to market of products and thus affects economic benefits. [0003] The parameters and performance of integrated chips exhibit different characteristics under different temperature conditions, mainly including normal temperature (25°C) characteristics, low temperature (below 25°C) characteristics and high temperature (higher than 25°C) characteristics. In the research and development, factory testing and application development of i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2875G01R31/2879
Inventor 邴春秋胡承志
Owner SG MICRO
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