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Polishing device for indium phosphide substrate

A polishing device and indium phosphide technology are applied in the field of indium phosphide polishing, which can solve the problems of high environmental requirements, unstable polishing effect, complex chemical composition and the like, and achieve the effect of saving production costs

Pending Publication Date: 2021-05-28
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually, the polishing of InP single crystal substrates mainly adopts electrochemical polishing technology or mechanical polishing technology, but the polishing effect of the two is not stable, and the polishing uniformity is not ideal, especially the chemical composition of the polishing liquid in the electrochemical polishing technology is relatively low. Complicated and demanding on the environment

Method used

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  • Polishing device for indium phosphide substrate
  • Polishing device for indium phosphide substrate
  • Polishing device for indium phosphide substrate

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Embodiment Construction

[0019] See attached figure 1 , a polishing device for an indium phosphide substrate, comprising an electrolytic tank 3, an anode disc support rod 8 positioned at the center of the bottom of the electrolytic tank 3 by means of an anode lifting mechanism, an anode disc 7 hinged on the upper end of the anode disc support rod 8, The cathode lifting mechanism is positioned on the cathode disk support rod 16 above the anode disk 7, the cathode disk 1 arranged at the lower end of the cathode disk support rod 16, the polishing cloth 13 positioned on the lower end surface of the cathode disk 1 by means of the cathode polishing cloth clamp 18, and the The mechanism is arranged on the graphite electrode plate 9 on the anode disk 7, the group of planetary wheels 17 arranged on the upper end surface of the graphite electrode plate 9 by means of the intermediate drive mechanism, and the group of planetary wheels 17 positioned on the graphite electrode plate 9 and the planetary wheel 17 by me...

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Abstract

The invention discloses a polishing device for an indium phosphide substrate, and belongs to the technical field of indium phosphide polishing. The polishing device comprises an electrolytic bath. The polishing device further comprises an anode disc supporting rod located in the center of the bottom of the electrolytic bath through an anode lifting mechanism, an anode disc hinged to the upper end of the anode disc supporting rod, a cathode disc supporting rod located above the anode disc through a cathode lifting mechanism, a cathode disc arranged at the lower end of the cathode disc supporting rod, a graphite electrode plate arranged on the anode disc through a connecting mechanism, a wandering star wheel set arranged on the upper end face of the graphite electrode plate through a middle driving mechanism, an anode rotation driving mechanism connected with the middle driving mechanism, a cathode rotation driving mechanism connected with the cathode disc supporting rod, and a polishing direct-current power supply connected with contacts of the anode disc supporting rod and the cathode disc supporting rod through wires. The structure of the device is improved, so that the requirement of the polishing process of indium phosphide on the environment is greatly reduced, and electrochemical and mechanical dual polishing is realized.

Description

technical field [0001] The invention belongs to the technical field of indium phosphide polishing, and in particular relates to a polishing device for an indium phosphide substrate. Background technique [0002] InP material is an important III-V compound semiconductor material, which has the characteristics of high electron mobility and large saturation drift rate. It is the main basic material for realizing millimeter-wave circuits and terahertz electronic devices. InP-based devices have high-frequency, Low noise, high efficiency, anti-irradiation and other characteristics, it is the first choice for frequency bands above 100GHz, has excellent performance in W-band and higher frequency millimeter wave circuits, and is used in optical fiber communication, mobile communication, medical imaging, terahertz communication and other fields widely. [0003] The polishing technology of InP is an important index to measure its preparation level, and the flatness and low roughness o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B41/04B24B57/02B24B47/12
CPCB24B29/02B24B41/04B24B47/12B24B57/02
Inventor 王书杰孙聂枫王阳李晓岚史艳磊邵会民付莉杰刘铮孙同年刘惠生
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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