A kind of polishing process of indium phosphide substrate

Abstract

A polishing process for an indium phosphide substrate, which belongs to the technical field of indium phosphide polishing, is realized based on an indium phosphide polishing device, and the polishing device includes an electrolytic tank and an anode positioned at the center of the bottom of the electrolytic tank by means of an anode lifting mechanism Disk support rod, anode disk hinged on the upper end of the anode disk support rod, cathode disk support rod positioned above the anode disk by means of the cathode lifting mechanism, cathode disk arranged at the lower end of the cathode disk support rod, and anode disk arranged on the anode disk by means of a connecting mechanism The graphite electrode plate, the planetary wheel set arranged on the end surface of the graphite electrode plate by means of the intermediate drive mechanism, the anode rotation drive mechanism connected with the intermediate drive mechanism, the cathode rotation drive mechanism connected with the cathode disc support rod, and the anode disc respectively connected to the anode disc by means of wires Polished DC power supply connected to contacts of support rods and cathode disk support rods. By improving the structure and process of the device itself, combined with the advantages of electrochemical polishing and mechanical polishing technology, the polishing process of indium phosphide greatly reduces the environmental requirements, and the polishing effect is ideal.

Description

Technical field [0001] The present invention belongs to the field of phosphide of indium polishing, and more particularly to a polishing process of an indium substrate. Background technique [0002] INP material is an important III-V compound semiconductor material with high electron mobility and high saturation and drift rate. It is the main base material for realizing millimeter wave circuits and terahertz electronic devices. The INP base has high frequency. Low noise, high efficiency, anti-irradiation, etc., is the primary choice of 100GHz above the frequency band, which has excellent performance in W-band and higher frequency millimeter wave circuits, applied in optical fiber communication, mobile communication, medical imaging, terahertz communications. widely. [0003] The polishing technology of INP is to measure the important indicators of its preparation level, the polishing interface is flat, and the roughness is low for subsequent epitaxial growth. Usually the polishin...

AI Technical Summary

Problems solved by technology

Usually, the polishing of InP single crystal substrates mainly adopts electrochemical polishing technology or mechanical polishing technology, but the polishing effect of the two is not stable, and the polishing uniformity is not ideal, especially the chemical composition of the polishing liquid in the electrochemical polishing technology is relatively low. Complicated and demanding on the environment

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