A Lorawan-based Smart Grid Gateway
A smart grid and gateway technology, applied in the direction of reducing energy consumption, electrical components, electrical equipment components, etc., can solve problems such as high cost, no communication signal, and affecting business completion
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Embodiment 1
[0035] refer to figure 1 , a LoRaWAN-based smart grid gateway, comprising, a gateway component 100, including a control main board 101, a dual LoRa radio frequency component 102 electrically connected to the control main board 101, and a 100MHz gateway component 103; The communication component 200, including the first communication using WIFI an information module 201, a LoRa radio frequency communication antenna 202, and a calibration system clock 203; and a connection assembly, the connection assembly includes a first wire connected between the control motherboard 101 and the dual LoRa radio frequency components 102 and a connection between the first information module 201 and calibration The second wires between the system clocks 203 , the first wires and the plug terminals of the second wires are covered with insulating tape, and the connection assembly further includes a winding assembly 300 for wrapping the insulating tape.
[0036]Specifically, the main body of the pre...
Embodiment 2
[0041] refer to Figure 2-4 , this embodiment is different from the first embodiment in that the winding assembly 300 includes a first holding member 301, a second holding member 302 hingedly arranged with the first holding member 301, and a second holding member 302 arranged on the second holding member 302 and the first holding member 302. The winding rod 303 on the part 301 is provided with a tape head 304 at the end of the winding rod 303, wherein a connecting rod 305 is rotatably connected inside the first holding part 301 and the second holding part 302, and the connecting rod 305 is fixed with the winding rod 303, The connecting rod 305 extends into the first holding member 301 or the second holding member 302 and is provided with a centrifugal rod 306. A first elastic member 509307 is arranged between the centrifugal rod 306 and the first holding member 301 or the second holding member 302. The connecting rod 305 is arranged near the side wall of the first holding memb...
Embodiment 3
[0050] refer to Figure 5-7 This embodiment is different from the above embodiments in that the heat dissipation component 400 includes a connecting frame 401, a connecting plate 402 arranged on the connecting frame 401, and a heat sink 403 rotatably connected to the connecting plate 402, wherein the lower end of the connecting plate 402 is provided with There is an abutment plate 404, the abutment plate 404 is in contact with the core processor, a thermal pad is provided on the side of the abutment plate 404 close to the core processor, and a heat pipe 405 is wound on the heat sink 403 along the forward direction of the heat sink 403 The heat pipe 405 is flattened at one end close to the abutment plate 404 , the surface of the heat sink 403 is provided with a number of first slots 308 which are matched with the heat pipe 405 , and the heat sink 403 is provided with a number of slots 308 in the direction perpendicular to the first slot 308 . The second card slot 308, a water c...
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