High-density integrated circuit board composite target and preparation method thereof
An integrated circuit, high-density technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit components, etc., can solve the problems of large processing deviation risk and unguaranteed
Inactive Publication Date: 2021-05-28
鹤山市世安电子科技有限公司
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- Application Information
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Problems solved by technology
[0002] In the existing PCB production process, the alignment method of single target design is usually used for graphic alignment to prevent graphic offset, which can only ensure the alignment of the PCB line graphic and its single target, but for the Referenced entities are not guaranteed
For example, if only through holes are used for alignment, there will be a greater risk of processing deviation in the alignment of lines and laser holes; if only laser holes are used for alignment, there will be a greater risk of processing deviation in the alignment of lines and through holes
Method used
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[0024] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0025] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated i...
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Abstract
The invention discloses a high-density integrated circuit board composite target and a preparation method thereof. The high-density integrated circuit board composite target comprises a multi-layer high-density integrated circuit board, and the high-density integrated circuit board is provided with through holes, and the through holes are arranged at each corner of the high-density integrated circuit board; concentric rings are respectively arranged on the peripheries of the through holes; and a copper-free area is arranged on the circuit board on the lower layer of the through hole, and the copper-free area is rectangular. According to the high-density integrated circuit board composite target, alignment of the positions of the through hole and the laser hole can be considered at the same time by using the composite target designed by integrating the through hole and the laser hole, and the alignment degree of a circuit and two different hole primitives is guaranteed to the maximum extent. The high-density integrated circuit board can be a multi-layer board, generally, four layers, six layers, eight layers and the like, and the through hole penetrates through the high-density integrated circuit board or only penetrates through a specified layer of the high-density integrated circuit board.
Description
technical field [0001] The invention relates to the field of high-density integrated circuit board processing, in particular to a high-density integrated circuit board composite target and a preparation method thereof. Background technique [0002] In the existing PCB production process, the alignment method of single target design is usually used for graphic alignment to prevent graphic offset, which can only ensure the alignment of the PCB line graphic and its single target, but for the Referenced entities are not guaranteed. For example, if only through holes are used for alignment, there will be a greater risk of processing deviation in the alignment of lines and laser holes; if only laser holes are used for alignment, there will be a greater risk of processing deviation in the alignment of lines and through holes . Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. For this reason...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0266H05K1/0298H05K3/0017H05K3/0026H05K3/0047
Inventor 朱尹峰谭兴华
Owner 鹤山市世安电子科技有限公司