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A kind of epoxy resin hot melt adhesive and preparation method thereof

A technology of epoxy resin and hot melt adhesive, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of low bonding strength, poor corrosion resistance, low application value, etc., and achieve improved bonding strength , Excellent adhesive performance, strong interaction effect

Active Publication Date: 2021-11-16
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these supramolecular hot melt adhesives have the advantages of viscous flow and low viscosity, they cannot meet the actual use requirements due to their low bonding strength and poor corrosion resistance, and their application value is low.

Method used

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  • A kind of epoxy resin hot melt adhesive and preparation method thereof
  • A kind of epoxy resin hot melt adhesive and preparation method thereof
  • A kind of epoxy resin hot melt adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0050] The preparation method of above-mentioned epoxy-based hot-melt adhesive, by:

[0051] Polyetheramines with one amine group:

[0052]

[0053] Polyetheramine UPy derivatives containing one amine group:

[0054]

[0055] and epoxy resins with two epoxy groups:

[0056]

[0057] Adopt melting method to carry out reaction and obtain, the molecular formula of the hot-melt adhesive based on epoxy resin obtained is as follows:

[0058]

[0059] The concrete process of above-mentioned preparation method is:

[0060] Prepare raw materials in molar portions;

[0061] Under high temperature conditions, polyetheramine, polyetheramine UPy derivatives and epoxy resin are fully stirred and mixed to obtain an epoxy resin hot melt adhesive prepolymer;

[0062] Under high temperature conditions, the epoxy resin hot melt adhesive prepolymer is cured for a period of time to obtain the epoxy resin hot melt adhesive.

[0063] In the above-mentioned preparation method, prepare ...

Embodiment 1

[0088] a is 1, b is 6.4, z is 0.18, m is 9, n is 1, and α=0.5.

[0089]

[0090] Weigh:

[0091] Epoxy resin: 3.92g

[0092] Polyetheramine: 3.01g

[0093] Polyetheramine UPy derivative: 3.01g

[0094] Stir and mix polyetheramine, polyetheramine UPy derivatives and epoxy resin at 50°C for 0.5 hours, pour it into a polytetrafluoroethylene watch glass after fully stirring, and cure at 50°C for 24 hours. Cool to room temperature, obtain 9.43g epoxy resin hot-melt adhesive, productive rate is 95%. The lap shear strength was measured at 2.72 MPa. 1 H-NMR (CDCl 3 ),δ(ppm):12.95(s,0.50H),11.71(s,0.71H),9.87(s,0.75H),6.97(d,10.21H),6.65(d,10.13H),5.65(s ,1H),3.40(m,89.14H),2.05(s,3.31H),1.47(s,16.1H),0.98(m,54.15H).

Embodiment 2

[0096] a is 1, b is 6.4, z is 0.18, m is 9, n is 1, and α=0.8.

[0097]

[0098] Weigh:

[0099] Epoxy resin: 3.92g

[0100] Polyetheramine: 1.20g

[0101] Polyetheramine UPy derivative: 4.80g

[0102] Stir and mix polyetheramine, polyetheramine UPy derivatives and epoxy resin at 60°C for 0.1 hour, pour it into a polytetrafluoroethylene watch glass after fully stirring, and cure at 60°C for 12 hours. Cool to room temperature, obtain 8.93g epoxy resin hot-melt adhesive, productive rate is 90%. The lap shear strength was measured to be 10.04 MPa. The nuclear magnetic pattern of the hot-melt adhesive of the preparation of present embodiment two is as figure 1 As shown, the infrared spectrum of the hot melt adhesive is shown as Figure 9 shown. 1 H-NMR (CDCl 3 ),δ(ppm):12.95(s,0.51H),11.71(s,0.71H),9.87(s,0.75H),6.97(d,6.78H),6.65(d,6.80H),5.65(s ,1H),3.40(m,57.16H),2.05(s,3H),1.47(s,10.59H),0.98(m,34.44H).

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Abstract

The invention belongs to the technical field of polymer materials, supramolecular materials and adhesives, and in particular relates to an epoxy resin hot melt adhesive and a preparation method thereof. The invention uses epoxy resin, polyether amine and polyether amine ureido pyrimidinone derivatives to prepare epoxy resin hot melt adhesive material. Under high temperature conditions, UPy dissociates, the hot melt adhesive flows, and infiltrates the surface of the adherend; under low temperature conditions, UPy associates, and the hot melt adhesive solidifies, bonding the adherends together. UPy-based epoxy resin hot melt adhesives have the advantages of repeatable bonding, high bonding strength, wide bonding range, fast bonding speed, low bonding temperature, adjustable bonding strength, and environmental protection. The epoxy resin hot-melt adhesive prepared by the invention has a simple structure and wide sources of raw materials. In the process of preparing the epoxy resin hot-melt adhesive, no solvent is used, and the solid content of the hot-melt adhesive is 100%, which is an environment-friendly adhesive. At the same time, the process of the invention is simple, no by-product is generated, no waste is discharged, and the atom utilization rate is 100%.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, supramolecular materials and adhesives, and in particular relates to an epoxy resin hot melt adhesive and a preparation method thereof. Background technique [0002] Hot melt adhesive refers to a type of adhesive that is solid at room temperature, melts into a liquid state after heating, and is bonded by physical solidification or chemical solidification after coating and cooling. Hot melt adhesives can be divided into thermoplastic hot melt adhesives and thermosetting hot melt adhesives. Thermoplastic hot-melt adhesive polymer chains are not connected by covalent bonds, have a linear molecular chain structure, and have the advantages of high initial bonding strength and repeatable bonding. Thermosetting hot melt adhesives have a chemically cross-linked three-dimensional network structure, which has the advantages of high bonding strength, heat resistance and corrosion resistance (Ind....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/50C09J163/00
CPCC08G59/504C08G59/5073C08G2170/20C09J163/00
Inventor 张希徐江飞孙鹏李育全
Owner TSINGHUA UNIV
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