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A kind of pressureless sintering conductive silver paste and preparation method thereof

A technology of conductive silver paste and formula, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems that the product shear force cannot meet the requirements and complexity, and achieve less agglomeration, Increased shear force and low sintering temperature

Active Publication Date: 2021-11-05
深圳市晨日科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This invention improves the low-temperature sintering compactness of the conductive silver paste by adopting the method of surface modification, which is relatively complicated, and the shear force of the product obtained after sintering cannot meet the requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0058] The preparation method of the pressureless sintering conductive silver paste comprises the following steps:

[0059] (1) Preparation of carrier

[0060] Weigh the amount of carrier, water and solvent in the formula, add them into the container and stir at a high speed to dissolve them, then add the dispersant and stabilizer in the amount of formula and continue stirring to completely dissolve to obtain the carrier;

[0061] (2) Preparation of slurry

[0062] The nanometer silver powder that takes formula consumption is added in the carrier that step (1) prepares, stirs, obtains pressureless sintering silver paste;

[0063] The high temperature stirring speed described in the above step (1) is 1000-1200rpm, and the described rotating speed of continuing stirring is 500-600rpm;

[0064] The stirring speed described in the above step (2) is 500-600rpm.

Embodiment 1

[0066] A kind of pressureless sintering conductive silver paste, comprising the following components: nano silver powder 61.7g, hydroxyethyl cellulose 3g, water 5g, ethylene glycol 15g, ethyl cellosolve 15g, polyvinylpyrrolidone 0.3g; Described nanometer silver powder is the silver powder that only carries out centrifugal sedimentation, does not carry out high-temperature drying, and the moisture content of described nanometer silver powder is 10%; The particle diameter D50 of described nanometer silver powder is 20 nanometers;

[0067] The preparation method of the pressureless sintering conductive silver paste comprises the following steps:

[0068] (1) Preparation of carrier

[0069] Weigh 3g of hydroxyethyl cellulose, 5g of water, 15g of ethylene glycol and 15g of ethyl cellosolve, add to the container and stir at a high speed of 1000rpm to dissolve, then add 0.3g of polyvinylpyrrolidone and continue stirring at a speed of 500rpm 1h, make it dissolve completely, obtain ca...

Embodiment 2

[0075] A kind of pressureless sintering conductive silver paste, comprises the component of following quality: Nano silver powder 65.2g, polyvinyl formal 3.5g, ethylene glycol 15g, n-butanol 16g, polyethylene glycol 0.3g; Described nano Silver powder is the silver powder that only carries out centrifugal sedimentation, does not carry out high-temperature drying, and the moisture content of described nano-silver powder is 8%; The particle diameter D50 of described nano-silver powder is 60 nanometers;

[0076] The preparation method of the pressureless sintering conductive silver paste comprises the following steps:

[0077] (1) Preparation of carrier

[0078] Weigh 3.5g of polyvinyl formal, 15g of ethylene glycol and 16g of n-butanol, add them into the container and stir at a speed of 1200rpm to dissolve them, then add 0.3g of polyethylene glycol and continue stirring at a speed of 600rpm for 1h to make it Completely dissolve to obtain the carrier;

[0079] (2) Preparation of...

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Abstract

The invention discloses a pressureless sintered conductive silver paste and a preparation method thereof, belonging to the technical field of metal materials. The pressureless sintering conductive silver paste includes the following components in mass percentage: 30%-65% of nano-silver powder, 2%-5% of carrier, 30%-65% of solvent, and 0.2%-2% of dispersant The nano-silver powder is only centrifuged and not dried at high temperature, and the moisture content of the nano-silver powder is 0-20%; the particle size range D50 of the nano-silver powder is 5-80 nanometers, The nano-silver powder used in the present invention is not dried at high temperature, the agglomeration of the nano-powder is less, and the sintering temperature can be low, which can better realize the encapsulation and interconnection of the silver powder and the base material, and improve the reliability of the device; Cyclodextrin and triammonium citrate with a mass ratio of 1:2‑4 were added to the slurry component as stabilizers, which significantly increased the shear force of the slurry after sintering.

Description

technical field [0001] The invention belongs to the technical field of metal materials, and in particular relates to a pressureless sintered conductive silver paste and a preparation method thereof. Background technique [0002] With the development of 5G technology and the expiration of the EU RoSH directive for the exemption of lead-containing solder, the requirements for packaging and interconnection materials have been qualitatively improved. Today, the most common 4G mobile phones will use 5-7 power amplifiers in the RF module Chips, due to the application of 5G technology, the number of chips is expected to double. The increase in the number of chips makes the soldering materials between chips particularly critical, and materials with heat resistance and strong conductivity should be selected. Compared with traditional high-lead solder, it is necessary to develop more environmentally friendly packaging and interconnection materials, which are suitable for higher frequ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 刘焕明钱雪行
Owner 深圳市晨日科技股份有限公司