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Conductive long fiber thermoplastic compounds for electromagnetic shielding

A conductive fiber, electromagnetic shielding technology, applied in the field of thermoplastic products, can solve the problems of multiple conductive fillers, high cost, large processing, etc.

Pending Publication Date: 2021-06-04
埃万特公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, to meet or exceed typical EMI / RFI shielding requirements, relatively high levels of conductive filler may be required
Disadvantageously, conductive plastics that include relatively large amounts of conductive fillers may have relatively higher costs and relatively greater processing, molding, and manufacturing difficulties than conductive plastics that include relatively small amounts of conductive fillers
In addition, relatively high amounts of conductive fillers can lead to undesired weight gain in end-use products

Method used

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  • Conductive long fiber thermoplastic compounds for electromagnetic shielding
  • Conductive long fiber thermoplastic compounds for electromagnetic shielding
  • Conductive long fiber thermoplastic compounds for electromagnetic shielding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0112] Non-limiting examples of thermoplastic compounds of various embodiments of the present invention are provided herein below.

[0113] Table 2a below shows the sources of ingredients for the thermoplastic compounds of Examples 1 to 15.

[0114]

[0115]

[0116] Examples of thermoplastic compounds were pultruded at processing temperatures typically used for the corresponding thermoplastic resins, and cut into pellets. Subsequently, test specimens were prepared by injection molding and then evaluated for the recorded properties.

[0117] Table 3 below shows the formulations and certain properties of Examples 1 to 3.

[0118]

[0119]

[0120] Table 4 below shows the formulations and certain properties of Examples 4 to 6.

[0121]

[0122] Table 5 below shows the formulations and certain properties of Examples 7 to 9.

[0123]

[0124] Table 6 below shows the formulations and certain properties of Examples 10 to 12.

[0125]

[0126] Table 7 below s...

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Abstract

Thermoplastic compounds in the form of a pellet include thermoplastic resin and conductive fibers. The conductive fibers are enveloped by the thermoplastic resin and distributed within the pellet such that each of at least a portion of the conductive fibers is substantially surrounded by the thermoplastic resin and thereby substantially separated from physical contact with any other of the conductive fibers. Additionally, at least a portion of the conductive fibers includes long fibers. The thermoplastic compound, when molded at a thickness of about 3.2 mm, has an electromagnetic shielding effectiveness across a range of frequencies from about 0.5 GHz to about 2.0 GHz of at least about 60 dB according to ASTM D4935, which makes the thermoplastic compound useful for molding thermoplastic articles for shielding against electromagnetic interference.

Description

[0001] priority statement [0002] This application claims priority to U.S. Provisional Patent Application Serial No. 62 / 746,129 (Attorney Docket No. 12018029), filed October 16, 2018, which is incorporated herein by reference. [0003] field of invention [0004] The present invention relates to conductive long fiber thermoplastic compounds and thermoplastic articles molded therefrom, which are useful for shielding against electromagnetic interference. [0005] Background of the invention [0006] Electronic systems, devices and equipment are everywhere. The modern world relies on electronics for numerous markets and industries such as aerospace, automotive, consumer, entertainment, financial, industrial, logistics, manufacturing, medical, retail, telecommunications and transportation. [0007] As electronic devices have grown in popularity, there has been an increasing need for means of shielding electronic devices from electromagnetic interference (EMI), sometimes referred...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K7/02C08K9/02C08K3/04C08K3/08B29B7/90H05K9/00
CPCB29B7/90C08K3/08C08K9/02B29B9/06B29B9/14B29B9/12B29B7/007B29B7/726C08K7/06C08K2201/001C08K2201/004H05K9/009
Inventor R·胡安J·普亚托高仁龙D·桑切斯
Owner 埃万特公司