Immersed heat dissipation system

A heat dissipation system and immersion technology, applied in the fields of instruments, computing, electrical digital data processing, etc., can solve the problems of large power consumption for cooling liquid cooling and heat exchange, unfavorable energy saving, high heat generation, reduce power consumption, and benefit Popularization and promotion, the effect of lowering the selling price

Pending Publication Date: 2021-06-08
BLUEOCEAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For various models, most users pay attention to the experience of the performance of the whole machine, and the configuration is usually high, so that the power of the whole machine is also continuously improved; that is, the heat of the whole machine is relatively high, so people have developed a computer host using liquid The cooling method is used to cool the computer motherboard and the accessories on the motherboard, so that the coolant is continuously circulated and exchanged to achieve high-efficiency cooling of the computer motherboard and its accessories. Generally, a heat exchanger is used for cooling. However, the heat exchanger includes a condenser tube on the condenser, an evaporator and a compressor, resulting in a bulky heat exchanger, which makes the computer mainframe larger. At the same time, the coolant cools the heat exchange. The volume is also large, which is not conducive to energy saving, and makes this type of computer mainframe expensive, and cannot be applied to ordinary consumers, so it has caused great trouble to the popularization of immersion liquid cooling computers

Method used

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Examples

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Embodiment

[0020] As shown in the drawings, the submerged heat dissipation system described in this embodiment includes a main box 1, and a cooling box 2 and a cooling liquid cooling device 5 are arranged in the main box 1, and the side inner wall of the cooling box 2 A main board 3 is fixed on the main board 3, and a plurality of accessories 31 spaced apart from each other are vertically installed on the main board 3. A buffer plate body 32 is arranged on the bottom side of the accessories 31, and a flow guide hole 321 is arranged on the buffer plate body 32. The cooling box The body 2 is provided with a liquid outlet 211 and a liquid inlet 221, and the liquid outlet 211 is equipped with a liquid outlet pipe 4; the cooling liquid cooling device 5 includes a cooling housing 51, a rotating drive motor 52, and a cooling housing 51. The first helical duct 53, the planetary gear set (not marked in the figure) and the stirring frame 56, wherein the first helical duct 53 and the cooling shell 5...

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Abstract

The invention discloses animmersed heat dissipation system. The immersed heat dissipation system comprises a box body, a cooling box body and a cooling liquid cooling device are arranged in the box body, a main plate is fixed to the side inner wall of the cooling box body, a plurality of accessories arranged at intervals are vertically installed on the main plate, buffer plate bodies are arranged on the side edges of the bottom ends of the accessories, and flow guide holes are formed in the buffer plate bodies; the cooling box body is provided with a liquid outlet and a liquid inlet, and the liquid outlet is provided with a liquid outlet pipeline; and a liquid outlet port of a first spiral pipeline of the cooling liquid cooling device is butted and communicated with a liquid inlet in the cooling box body. According to the invention, an immersed heat dissipation type computer host can be reduced, and meanwhile, the electricity consumption and the selling price of the immersed liquid cooling computer host are greatly reduced, and popularization and promotion of an immersed liquid cooling computer are facilitated.

Description

technical field [0001] The invention relates to the technical field of cooling a computer mainframe in a liquid cooling manner, in particular to an immersion heat dissipation system. Background technique [0002] With the development of science and technology and the improvement of application requirements, electronic products are constantly being introduced. For various models, most users pay attention to the experience of the performance of the whole machine, and the configuration is usually high, so that the power of the whole machine is also continuously improved; that is, the heat of the whole machine is relatively high, so people have developed a computer host using liquid The cooling method is used to cool the computer motherboard and the accessories on the motherboard, so that the coolant is continuously circulated and exchanged to achieve high-efficiency cooling of the computer motherboard and its accessories. Generally, a heat exchanger is used for cooling. Howeve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201
Inventor 白瑞晨
Owner BLUEOCEAN TECH CO LTD
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