Quick-release combination mechanism of lower die holder of punching machine
A combined mechanism and quick-release technology, which is applied in metal processing, electrical components, printed circuit manufacturing, etc., can solve the problems of reduced processing efficiency, easy wear, frustration, poor punching effect, etc., to achieve quick disassembly, improve Machining efficiency and the effect of saving tool change time
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Embodiment 1
[0027] This embodiment proposes a quick-detachable combination mechanism for the lower die base of the punching machine, combining Figure 1 to Figure 4 As shown, it includes a lower mold base body 100, a lower mold push block 101 and a lower mold knife edge plate 102, the top of the lower mold base body 100 is provided with a lower mold chute 103, and the lower mold push block 101 is located at In the lower mold chute 103, and the lower mold push block 101 can slide relative to the lower mold chute 103, and the top of the lower mold base 100 is fixed with two lower mold stoppers 104, two The lower mold limiting plate 104 is separately arranged on both sides of the lower mold chute 103, and the two sides of the lower mold pushing block 101 are respectively provided with push block slots 105, and the edges of the two lower mold limiting plates 104 are respectively engaged. Set in the push block slot 105, the lower mold knife edge plate 102 is fixed on the top of the lower mold ...
Embodiment 2
[0037]In practical applications, in order to ensure the accuracy of the punching position, the graphic target point is generally pre-printed on the PCB board, and the camera is installed on the die base of the punching machine at the same time, and the punching position of the punching needle is determined by the position of the graphic target point collected by the camera. . However, due to the expansion and contraction of the PCB board under different environmental conditions, and its expansion and contraction coefficient cannot be determined, the punching needle cannot be accurately translated to the target position, thereby affecting the accuracy of the punching position, thereby reducing the processing of the PCB board yield.
[0038] In this regard, this embodiment proposes a lower mold with an optical reference target, which helps the control system to calculate the expansion and contraction coefficient of the PCB board, and helps to accurately control the punching posi...
Embodiment 3
[0045] In practical applications, in order to ensure the accuracy of the punching process, the control system needs to monitor and collect images on the surface of the PCB board. The existing technical means generally use a vertically installed camera to capture the surface image of the PCB board, but this vertical A vertically installed camera will occupy a certain amount of vertical space, and it is not convenient to install on the upper die base of the punching machine, so it is difficult to meet the assembly requirements of the equipment.
[0046] In this regard, this embodiment proposes a 90-degree image acquisition mechanism for an alignment camera that can be horizontally fixed on the bottom of the upper die base and helps save the vertical space of the punching machine. Figure 7 to Figure 10 As shown, it includes an upper mold base 130 and a lower mold base 100, the lower mold base 100 is located below the upper mold base 130, and the lower mold base 100 is provided wi...
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