Precise instrument electroplating method

Abstract

The invention provides a precise instrument electroplating method which is achieved by using precise instrument electroplating equipment so as to finish electroplating of a precise instrument. The precise instrument electroplating equipment comprises an electroplating bath main body, and a sealing mechanism is mounted on the right side in the electroplating bath main body in a sliding manner. When impurities floating on the liquid level of the electroplating liquid are removed, a sliding plate can be pulled in a left-right reciprocating mode along two sliding grooves by grabbing a pulling plate, and therefore a sponge block arranged on the bottom end face of the sliding plate makes contact with the impurities floating on the liquid level of the electroplating liquid; and due to the porous material characteristics of the sponge block, the impurities floating on the liquid level of the electroplating liquid are blocked and adsorbed into gaps of the sponge block, and cleaning operation of the impurities floating on the liquid level of the electroplating liquid is achieved.

Description

Technical field [0001] The present invention belongs to the field of electroplating technology, and more particularly to a precision instrument electroplating method. Background technique [0002] The electroplating is the process of plating a thin layer of other metal or alloys on certain metal surfaces using electrolysis principles, and is an electrolytic action to attach a layer of metal film to prevent metal oxidation ( Such as rust), improve wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhancement. [0003] ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,. A telescopic seam structure, the adjacent two electroplating grooves provided by the extended seam structure connection spaced. The present invention provides an electroplating groove structure that collides or leakage the plating tank and the plating tank when the electroplating groove and the plating tank are...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above technical problems, the present invention provides a precision instrument electroplating method to solve the problem that some impurities will float on the surface of the electroplating solution after the electroplating application in the existing electroplating tank is completed, and a small amount of impurities will remain inside the electroplating solution. Nowadays, the impurities in the electroplating solution are usually cleaned by discharging all the electroplating solution in the electroplating tank, and then blocking and cleaning the impurities in the discharged electroplating solution through filtration and other methods. And the subsequent re-addition of electroplating solution to the electroplating tank is also a problem of high-intensity work

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