Unlock instant, AI-driven research and patent intelligence for your innovation.

Light-emitting device manufacturing method and light-emitting device

A technology of a light-emitting device and a manufacturing method, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problem of inappropriate radian and angle, affecting the luminous flux and process yield of the positive light-emitting surface, and low controllability of the radian and angle of the inclined surface, etc. question

Pending Publication Date: 2021-06-11
APT ELECTRONICS
View PDF9 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the LED devices disclosed in these two patents, the blue light on the side can be reflected by the white glue, converted by the fluorescent film, and emitted from the front light exit surface, which can not only prevent blue light from leaking from the side of the device, but also increase the luminous flux on the front light exit surface. These two manufacturing methods have low controllability of the radian and angle of the inclined surface around the chip. Due to the influence of surface tension, silica gel is easy to level off on the surface of the fluorescent film, resulting in improper radian and angle of the inclined surface, which will affect the positive light emitting surface. Luminous flux and process yield

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light-emitting device manufacturing method and light-emitting device
  • Light-emitting device manufacturing method and light-emitting device
  • Light-emitting device manufacturing method and light-emitting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] This embodiment provides a method for manufacturing a light emitting device, including steps:

[0051] S11, such as figure 1 As shown, a number of holes 7 are made on the light conversion film 3 by using a molding process;

[0052] S12, such as figure 2 As shown, the light-emitting element 2 is fixed on the light conversion film 3, and the light-emitting element 2 is located between two adjacent cutting parts with a large interval;

[0053] S13, such as image 3 As shown, a first light-transmitting layer 4 is covered between the four sides of the light-emitting element 2 and the hole 7;

[0054] S14, such as Figure 4 As shown, cut along the cutting part to obtain several single light-emitting elements 202 with the light conversion film 3 and the first transmission layer;

[0055] S15, such as Figure 5 As shown, the light-emitting element 202 with the light conversion film 3 and the first light-transmitting layer 4 is fixed on the base 1;

[0056] S16, such as ...

Embodiment 2

[0060] This embodiment provides a method for manufacturing a light emitting device, including steps:

[0061] S21, such as Figure 8 As shown, a number of square protrusions 8 are made on the light conversion film 3 by using a molding process;

[0062] S22, such as Figure 9 As shown, the light-emitting element 202 is fixed on the light conversion film 3, and the light-emitting element 2 is located between two adjacent cutting parts with a large interval;

[0063] S23, such as Figure 10 As shown, a first light-transmitting layer 4 is covered between the four sides of the light-emitting element 2 and the square protrusion 8;

[0064] S24, such as Figure 11 As shown, cut along the cutting part to obtain several single light-emitting elements 2 with light conversion film 3 and first transmission layer;

[0065] S25, such as Figure 12 As shown, the light-emitting element 2 with the light conversion film 3 and the first light-transmitting layer 4 is fixed on the substrate 1;...

Embodiment 3

[0070] This embodiment provides a light emitting device, such as Figure 15 As shown, it includes: a substrate 1, a light-emitting element 2, a light conversion film 3, a light reflection layer 5, a first light-transmitting layer 4 and a second light-transmitting layer 6; the light-emitting element 2 is fixed on the upper surface of the substrate 1, and the second A light-transmitting layer 4 is laid on the four sides of the light-emitting element 2, the lower surface of the light conversion film 3 not in contact with the light-emitting element 2, and the light-reflecting layer 5 is laid on the upper surface not covered by the light-emitting element 2, and covers The side of the first light-transmitting layer 4, the second light-transmitting layer 6 is laid on the upper surface of the light conversion film 3, the four sides of the light conversion film 3, the slope of the light reflection layer 5, and the substrate 1 is not covered by the light reflection layer. 5 covers the u...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a light-emitting device manufacturing method and a light-emitting device. The manufacturing method comprises the steps: manufacturing a plurality of cutting components on a light conversion film; enabling a light-emitting element to be fixed to the light conversion film, wherein the light-emitting element is located between every two adjacent cutting parts with the large interval; covering a first light transmission layer between the four side surfaces of the light-emitting element and the cutting part; cutting along the cutting part to obtain a plurality of single light-emitting elements with light conversion films and first transmission layers; fixing the light-emitting element with the light conversion film and the first light transmission layer on the substrate; covering the side face of the first light transmission layer with a light reflection layer; carrying out mold pressing packaging, and covering a second light transmission layer; and cutting the middle lines of the two adjacent light-emitting elements to obtain a single light-emitting device. When the cutting part is manufactured on the light conversion film and the first light transmission layer is laid on the periphery of the chip, the first light transmission layer is blocked, forming of the inclined plane is facilitated, and the angle of the inclined plane can be controlled through the position of the cutting part.

Description

technical field [0001] The invention belongs to the technical field of light-emitting diodes, and in particular relates to a method for manufacturing a light-emitting device and the light-emitting device. Background technique [0002] Light-emitting diodes are commonly used electronic components. In order to improve their performance, the manufacturing method of light-emitting diodes is usually optimized. [0003] The application with the publication number CN107507904A discloses a CSP LED and its manufacturing method, including: S1: fix the fluorescent film on the substrate, and place a square light-transmitting rubber block on the fluorescent film; S2: sink the light-emitting chip face down Put it into the light-transmitting rubber block, and form an inclined surface on the outside by extrusion; S3: Dot a layer of white glue between the light-emitting chips and between the electrodes. After curing, cut the white glue to obtain a single-sided CSP LED. [0004] The applicat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/60H01L33/54
CPCH01L33/50H01L33/60H01L33/54
Inventor 全美君徐志荣姜志荣刘明曾照明肖国伟
Owner APT ELECTRONICS