A bottom blowing nitrogen vacuum copy exposure device near contact lithography machine
A technology of exposure device and lithography machine, which is applied in the direction of microlithography exposure equipment, photolithography exposure device, photomechanical equipment, etc. It can solve the problems of affecting the quality of CD feature size, difficult gas discharge, and easy generation of air gaps. Achieve the effect of simple structure, stable and reliable performance, and high consistency
Active Publication Date: 2022-07-12
三河建华高科有限责任公司
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Problems solved by technology
[0005] Aiming at the deficiencies of the prior art, the present invention provides a nitrogen-blowing vacuum copying exposure device at the bottom of a close-contact lithography machine, which solves the problem of contact exposure between the lower surface of the mask plate and the rubber-coated crystal in the existing close-contact lithography machine. Air gaps are easy to form between the upper surfaces of the circles, and the gas is difficult to discharge, which affects the quality of the CD feature size
Method used
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[0021] like figure 1 As shown, the embodiment of the present invention provides a bottom blowing nitrogen vacuum copying exposure device close to the contact lithography machine. The upper surface is provided with an annular groove, the upper surface of the suction cup 1 is provided with a wafer 4, the upper surface of the wafer 4 is coated with an adhesive layer, the first air channel 2 is communicated with the annular groove, and the first air channel 2 is evacuated, Due to the connection of the annular groove, the wafer 4 coated with the adhesive layer is sucked on the surface of the suction cup 1, the side of the adhesive layer of the wafer 4 is facing up, a mask 5 is arranged above the suction cup 1, and the glue layer of the wafer 4 is The upper surface of the layer is in contact with the lower surface of the mask 5, the mask 5 and the suction cup 1 are parallel to each other, and the two are not in direct contact, and the side surface of the upper part of the suction cu...
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Abstract
The invention provides a bottom nitrogen-blowing vacuum copy exposure device of a proximity-contact lithography machine, and relates to the technical field of proximity-contact lithography machine equipment. The bottom blowing nitrogen vacuum copy exposure device of the near-contact lithography machine includes a suction cup, the suction cup is provided with a first air path channel and a second air path channel, the upper surface of the suction cup is provided with an annular groove, and the suction cup is provided with an annular groove. The upper surface of the suction cup is provided with a wafer, the first air passage is communicated with the annular groove, a mask is set above the suction cup, and an outer circular inclined ring groove is set on the side of the upper part of the suction cup, and the outer circular groove is A sealing ring is installed inside the inclined ring groove, and the sealing ring is thin and conical. The invention can easily discharge the residual gas between the adhesive layer of the wafer and the lower surface of the mask, without generating air gaps, and after exposure, a pattern with high consistency and small CD feature size can be obtained on the entire wafer after exposure, and at the same time, the structure is simple , stable and reliable performance, easy to use, wide application range.
Description
technical field [0001] The invention relates to the technical field of proximity-contact lithography machine equipment, in particular to a bottom-blowing nitrogen-blown vacuum copy exposure device of a proximity-contact lithography machine. Background technique [0002] Proximity contact lithography machine is one of the key equipments in semiconductor device fabrication. Proximity contact lithography is to copy the pattern of the mask to the wafer. During the copying process, the lower surface of the mask needs to be in close contact with the upper surface of the wafer coated with glue. Through UV exposure, it is obtained on the wafer. Desired graphics and CD feature dimensions. When obtaining the micro CD feature size (2um-0.8um), it is used to form a cavity between the mask, wafer, suction cup, and sealing ring, and the air in the cavity is extracted to form a vacuum cavity, so that the mask It is in close contact with the upper surface of the wafer coating, eliminating...
Claims
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IPC IPC(8): G03F7/20
CPCG03F7/70841G03F7/70866G03F7/70716G03F7/707
Inventor 周占福吕磊毛善高
Owner 三河建华高科有限责任公司