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Circuit board substrate selection method and device, terminal equipment and storage medium

A board substrate, circuit board technology, applied in the direction of electrical digital data processing, computer-aided design, special data processing applications, etc., can solve the problems of high cost of circuit boards, high cost of substrates, etc.

Active Publication Date: 2021-06-15
LAUNCH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present application provides a circuit board substrate selection method, device, terminal equipment and storage medium, aiming to solve the problem of high circuit board cost caused by the high substrate cost of the existing circuit board

Method used

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  • Circuit board substrate selection method and device, terminal equipment and storage medium
  • Circuit board substrate selection method and device, terminal equipment and storage medium
  • Circuit board substrate selection method and device, terminal equipment and storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] refer to figure 1 , is a system architecture diagram of the application of the circuit board substrate selection method provided in the first embodiment of the present application, and the system architecture is applied to a specific circuit board substrate selection system.

[0066] Such as figure 1 As shown, the circuit board substrate selection system includes a terminal device 2, a packaging information collection device 10 and a wiring length collection device 11 respectively communicatively connected to the terminal device 2, and the packaging information includes pin density.

[0067] In this embodiment, the workflow of the circuit board substrate selection system is as follows:

[0068] The terminal device 2 sends a package information collection instruction to the package information collection device 10 .

[0069] After receiving the package information collection instruction, the packaging information collection device 10 acquires the packaging information ...

Embodiment 2

[0077] see figure 2 , is a flow chart of the circuit board substrate selection method provided in the second embodiment of the present application, which is used to select the number of substrate layers and substrate materials for the target circuit board. The circuit board substrate selection method is applied to any terminal device, and the terminal The device can be computing devices such as desktop computers, notebooks, palmtop computers and cloud servers, and the method includes steps:

[0078] Step S10, obtaining packaging information of components on the target circuit board;

[0079] Wherein, the package information may be the pin density, the number of pin rows, the number of pin columns and / or the package image of the component, and the terminal device may acquire the package information by means of a package information collection device, the package information The acquisition device can receive the packaging information input by the user, or collect the images o...

Embodiment 3

[0100] see image 3 , is a flow chart of the circuit board substrate selection method provided by the third embodiment of the present application. The third embodiment describes step S40 in detail on the basis of including the second embodiment. The target circuit board is provided with at least One said connector, step S40 specifically includes:

[0101] Step S41, obtaining a wiring list corresponding to each of the connectors;

[0102] Wherein, by obtaining the connector identification of the connector, and querying the corresponding specification according to the connector identification, the specification includes a wiring list of the corresponding connector;

[0103] In this step, different connectors have different wiring lists corresponding to different signal transmission rates, and the wiring list stores the correspondence between the preset material and the second wiring length, and the second wiring length is corresponding to the preset material. The maximum wirin...

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PUM

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Abstract

The invention provides a circuit board substrate selection method and device, terminal equipment and a storage medium. The method comprises the steps: calculating the number of layers of a substrate according to the maximum pin density in the packaging information of components on a target circuit board, obtaining the number of layers of a target substrate, and determining all connectors in the components according to the packaging information; obtaining the wiring length of the connector on the target circuit board to obtain a first wiring length, and performing material matching according to the first wiring length to obtain a target substrate material; and selecting the substrate of the target circuit board according to the target substrate layer number and the target substrate material. According to the invention, the number of layers of the target substrate calculated through the maximum pin density is the minimum number of layers of the substrate required by the target circuit board, so that the manufacturing cost of the circuit board is reduced. After the material matching of the substrate is carried out according to the first wiring length to obtain the material of the target substrate, the target substrate material is the material with the lowest price on the premise of meeting the layout requirement and packaging quality of the target circuit board, so that the manufacturing cost of the circuit board is further reduced.

Description

technical field [0001] The present application belongs to the field of integrated circuit boards, and in particular relates to a circuit board substrate selection method, device, terminal equipment and storage medium. Background technique [0002] With the development and progress of science and technology, the manufacture of circuit boards has also developed rapidly. Circuit boards of different materials have different attenuation of signal transmission on the circuit board due to the difference in dielectric constant and dielectric loss angle. The signal attenuation corresponding to the substrate material with a smaller dielectric loss angle is smaller, but the relative cost is higher. Therefore, the selection of the circuit board substrate has attracted more and more attention. [0003] In the existing circuit board substrate selection process, the circuit board design requirements and the substrate cost are not well balanced, resulting in higher production costs and lowe...

Claims

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Application Information

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IPC IPC(8): G06F30/398G06F30/392G06F30/394G06K9/62
CPCG06F30/398G06F30/392G06F30/394G06F18/22Y02P90/30
Inventor 刘新廖义奎
Owner LAUNCH TECH CO LTD