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Polyimide precursor composition and polyimide film manufactured using same

A technology of polyimide precursor and polyimide film, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of heavy glass substrate and difficult continuous process, etc., to improve charge accumulation, improve Effect of high heat resistance characteristics

Active Publication Date: 2021-06-15
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Currently used glass substrates are heavy and brittle and difficult to apply to continuous processes

Method used

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  • Polyimide precursor composition and polyimide film manufactured using same
  • Polyimide precursor composition and polyimide film manufactured using same
  • Polyimide precursor composition and polyimide film manufactured using same

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0192] Polymerization of polyamic acid BPDA-pPDA / MA (98:100:4)

[0193] After charging 100 g of NMP (N-methyl-2-pyrrolidone) as an organic solvent into a reactor with nitrogen flow, 6.806 g (62.937 mmol) of p-benzene The diamine (p-PDA) dissolves. At the same temperature, add 18.147g (61.679mmol) 3,3',4,4'-biphenylcarboxylic dianhydride (s-BPDA) and 54.8g NMP to the solution containing p-PDA, and stir It is dissolved for a certain period of time to polymerize the polyamic acid. Then, 0.247 g (2.517 mmol) of maleic anhydride (MA) was added to the polyamic acid solution and stirred for 4 hours to prepare a polyimide precursor (CPI) having a capping group.

preparation example 2

[0194] Polymerization of polyamic acid BPDA-pPDA (98:100)

[0195] After charging 100 g of NMP (N-methyl-2-pyrrolidone) as an organic solvent into a reactor with nitrogen flow, 6.873 g (63.560 mmol) of p-benzene was allowed to The diamine (p-PDA) dissolves. At the same temperature, add 18.327g (62.289mmol) 3,3',4,4'-biphenylcarboxylic dianhydride (s-BPDA) and 54.8g NMP to the solution containing p-PDA and stir It was dissolved under time to prepare a polyimide precursor.

preparation example 3

[0196] Polymerization of polyamic acid BPDA-pPDA-ODA (99.88:50:50)

[0197]After charging 100 g of NMP (N-methyl-2-pyrrolidone) as an organic solvent into a reactor with nitrogen flow, 3.041 g (28.121 mmol) of p-benzene Diamine (p-PDA) and 5.631 g (28.121 mmol) of 4,4'-oxydiphenylamine (ODA) were dissolved. At the same temperature, 16.528g (56.175mmol) of 3,3',4,4'-biphenylcarboxylic dianhydride (s-BPDA) and 54.8g of NMP were added to the solution and allowed to dissolved to prepare polyimide precursors.

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Abstract

The present invention relates to a polyimide precursor composition, and a polyimide film manufactured using same. According to the present invention, since a polyimide film is manufactured from a mixture of a polyimide precursor having a structure that is advantageous to surface charge accumulation and a polyimide precursor having a structure capable of exhibiting high heat-resistant characteristics, a flexible device using the polyimide film as a substrate can have both improved charge accumulation characteristics caused by an electric field to be generated during the operation of a TFT device and heat high heat-resistant characteristics.

Description

technical field [0001] This application claims the benefit of priority of Korean Patent Application No. 10-2019-0017004 filed on February 14, 2019 and Korean Patent Application No. 10-2020-0006836 filed on January 17, 2020, all of which The disclosure is incorporated herein by reference. [0002] The present invention relates to a polyimide precursor composition and a polyimide film produced by using the same, and more particularly, to a polyimide film having improved surface charge density characteristics and high heat resistance characteristics. Background technique [0003] In recent years, weight reduction and miniaturization of products have been emphasized in the field of displays. Currently used glass substrates are heavy and brittle, and difficult to apply to continuous processes. Therefore, research is actively conducted to apply plastic substrates, which have advantages of being lightweight, flexible, and applicable to continuous processes, and which can replace ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J3/24H01L21/02C08J5/18
CPCC08G73/1014C08G73/1067C08G73/1042C08G73/1071C08L79/08C08J5/18C08J2379/08C08J3/24H01L21/02118H01L21/02205C08G73/101C08L2201/08C08L2203/16C08L2203/20
Inventor 朴珍永朴澯晓催丹碧
Owner LG CHEM LTD