Soldering method of semiconductor device and semiconductor device
A welding method and semiconductor technology, applied in the fields of semiconductor devices, semiconductor/solid-state device components, and semiconductor/solid-state device manufacturing, etc., can solve the problems such as the inability to discharge air bubbles smoothly, the high welding void rate, and the reduction of welding quality.
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[0035] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0036] Such as Figure 1 to Figure 7 As shown, the semiconductor device welding method provided in this embodiment specifically includes the following steps:
[0037] Provide groove structure: form a plurality of first grooves 11 extending along the first direction and arranged at intervals along the second direction on the surface of the first device 10, wherein, in the second direction, from the middle of the first device 10 to The widths of the plurality of first grooves 11 arranged in the direction of both sides gra...
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