Camera module chip packaging base assembly and manufacturing method thereof

A camera module and chip packaging technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve problems such as filter fragmentation, and achieve stable performance and reliable combination

Active Publication Date: 2021-08-13
SUZHOU GYZ ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The optical filter combined with the camera module chip package base of this structure will still be in contact with the surrounding hard plastic frame, and the edge of the optical filter may be broken.

Method used

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  • Camera module chip packaging base assembly and manufacturing method thereof
  • Camera module chip packaging base assembly and manufacturing method thereof
  • Camera module chip packaging base assembly and manufacturing method thereof

Examples

Experimental program
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Embodiment Construction

[0073] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer" and the like are based on the orientation or positional relationship shown in the accompanying drawings, and are only for It is convenient to describe the present invention and simplify the description, but does not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operate in a specific orientation, and thus should not be construed as limiting the present invention.

[0074] The camera module in the present invention is an important component of electronic devices with camera functions such as mobile phones and tablet computers. The camera module 1000 generally includes a printed circuit board (PCB) 1003 , an image sensor 1004 located on the printed circuit board 1003 , a voice coil motor 1005 and a lens 1001 . The voice coil motor 1005 is pr...

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Abstract

The present invention is a camera module chip packaging base combination, including a plastic base and a light filter, the plastic base has a light-transmitting part, the light filter is correspondingly arranged at the position of the light-transmitting part, and the light filter It has an upper surface and a lower surface and a periphery connecting the upper surface and the lower surface, at least the periphery and part of the lower surface of the optical filter are covered by a soft material so that the optical filter and the lower surface are covered by a soft material. The plastic bases do not touch. In the present invention, soft materials such as soft glue are used to paste the filter, and at the same time, soft materials such as thermoplastic elastomer materials are used to package the surroundings of the filter, which can effectively form a buffer layer and effectively prevent the filter from being assembled, tested, or dropped. Risk of rupture under such circumstances.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a camera module chip packaging base assembly in a camera module and a manufacturing method thereof. Background technique [0002] The camera module chip package base combination in the mobile phone camera module is a component on the mobile phone camera module, which is used between the electronic components on the PCB board and the voice coil motor. At present, the placement process of the infrared filter in the mobile phone camera module is: injection molding of pure plastic parts, and the placement factory uses specific glue to package the infrared filter and the camera module chip in the optical camera module through the IR method. The combination is pasted together to form an H / R assembly. The camera module chip package base combination in the optical camera module mainly refers to: AF-HOLDER base (suitable for optical cameras). At present, as mobile phones are becoming...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L23/12
CPCH01L21/56H01L23/12
Inventor 高强
Owner SUZHOU GYZ ELECTRONICS TECH CO LTD
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