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Packaging structure and manufacturing method thereof

A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve the problems of reducing the yield of chip packaging structure and the difficulty of manufacturing process of warpage phenomenon.

Pending Publication Date: 2021-06-18
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the yield rate of mounting the chip package structure on the printed circuit board is reduced
[0003] On the other hand, when it is intended to form a package-on-package (POP) structure in which one package structure is formed on another package structure, the warping phenomenon also causes difficulties in the manufacturing process.

Method used

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  • Packaging structure and manufacturing method thereof
  • Packaging structure and manufacturing method thereof
  • Packaging structure and manufacturing method thereof

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Embodiment Construction

[0044] In order to make the description of the present invention more detailed and complete, the following provides an illustrative description of the implementation aspects and specific embodiments of the present invention; but this is not the only form for implementing or using the specific embodiments of the present invention. The various embodiments disclosed below can be combined or replaced with each other when beneficial, and other embodiments can also be added to one embodiment, without further description or illustration. In the following description, numerous specific details will be set forth in order to enable readers to fully understand the following embodiments. However, embodiments of the invention may be practiced without these specific details.

[0045] Furthermore, spatially relative terms, such as "below", "below", "above", "above", etc., are for the convenience of describing the relative relationship between one element or feature and another element or fea...

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Abstract

The invention discloses a packaging structure which comprises a circuit redistribution structure, a wafer, an inner conductive strengthening element and a protection layer. The circuit redistribution structure includes a first circuit layer and a second circuit layer disposed on the first circuit layer. The first circuit layer is electrically connected with the second circuit layer. The wafer is disposed on the circuit redistribution structure and electrically connected to the second circuit layer. The inner conductive strengthening element is disposed on the circuit redistribution structure. The inner conductive strengthening element has a Young's modulus of 30-200 GPa. The protection layer covers the wafer and the opening side wall of the inner conductive strengthening element . The packaging structure disclosed by the invention has enough mechanical strength and is not easy to warp.

Description

technical field [0001] The present invention relates to a packaging structure and a manufacturing method of the packaging structure. Background technique [0002] Traditionally, a chip package structure includes a substrate, a chip on the substrate, and a packaging material layer covering the chip. Due to the large difference in thermal expansion coefficients of the substrate, chip and packaging material layer, the chip packaging structure is often severely warped when the thermal manufacturing process is performed to form the chip and packaging material layer on the substrate. Therefore, the yield of the chip package structure mounted on the printed circuit board is reduced. [0003] On the other hand, when it is intended to form a package-on-package (POP) structure in which one package structure is formed on another package structure, the warping phenomenon also causes difficulties in the manufacturing process. Contents of the invention [0004] Some embodiments of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L21/48
CPCH01L23/49811H01L23/49827H01L23/49838H01L23/49894H01L21/486H01L21/4853H01L2924/181H01L2224/16225H01L2924/15311H01L2224/48227H01L2224/48091H01L2924/00012H01L2924/00014
Inventor 王纯敏林溥如柯正达
Owner UNIMICRON TECH CORP