Capacitor epoxy packaging device based on intelligent manufacturing

Abstract

The invention relates to the technical field of capacitors, and discloses a capacitor epoxy packaging device based on intelligent manufacturing, which comprises an operation table, the surface of the operation table is provided with a filling cavity, the lower part of the filling cavity is provided with a fixed seat, the interior of the fixed seat is movably connected with a clamping plate, the lower surface of the fixed seat is provided with a main gear, a transmission gear is arranged on the surface of the main gear, and a top plate is arranged on the upper surface of the transmission gear. According to the capacitor epoxy packaging device based on intelligent manufacturing, the packaging shell and the filling cavity are used in cooperation, the packaging pipe and the push rod are used in cooperation, and the rotating block, the first piston rod and the second piston rod are used in cooperation; the first piston rod is used in cooperation with the air pipe, and the second piston rod is used in cooperation with the material pipe, so that when epoxy encapsulation operation is carried out on the surface of the capacitor, bubbles or recesses can be prevented from appearing on the surface of the capacitor, the epoxy encapsulation quality of the capacitor can be effectively improved, and the production quality of the capacitor can be improved.

Description

technical field [0001] The invention relates to the technical field of capacitors, in particular to an epoxy packaging device for capacitors based on intelligent manufacturing. Background technique [0002] A capacitor is a device that holds charges. It is widely used in various electronic devices and is one of the more commonly used electronic components. With the continuous development of network technology and industrial technology, existing capacitors have achieved intelligent manufacturing. When the capacitor is manufactured, it is necessary to encapsulate the semiconductor on its surface to protect the capacitor. When the existing capacitor is epoxy-encapsulated, the capacitor will shake, which will cause the epoxy-encapsulated material and the capacitor's pins Looseness between them will affect the use of capacitors. Bubbles or depressions are prone to appear on the surface of capacitor epoxy encapsulation. Poor epoxy encapsulation effect will affect the quality of ca...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a capacitor epoxy packaging device based on intelligent manufacturing, which has the advantages of good capacitor epoxy encapsulation and fixing effect, good operation effect of capacitor surface epoxy encapsulation, and high surface encapsulation quality , which solves the problem of poor fixing effect and low quality of epoxy encapsulation on the surface of existing capacitors when epoxy encapsulation is performed

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