Preparation method of lead frame
A lead frame and frame technology, which is used in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of incomplete silver plating, affecting the reliability of the lead frame, and reducing the production efficiency of the lead frame, so as to improve the use performance. Effect
Active Publication Date: 2021-06-22
江西新菲新材料有限公司
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Problems solved by technology
Due to the limitation of the precision of exposure equipment, there will be a deviation of 5um-20um in theory during the second alignment. If there is a deviation in the second alignment, it will cause the silver layer to be suspended or the silver plating to be incomplete after etching, making the lead wire The production efficiency of the frame is reduced, which affects the reliability of the subsequent use of the lead frame
Method used
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Embodiment Construction
[0022] Embodiments of the present invention are described in detail below, and the embodiments described with reference to the drawings are exemplary, and embodiments of the present invention are described in detail below.
[0023] Refer below Figure 1-Figure 3 Describe the preparation method of the lead frame 200 according to the embodiment of the present invention, the preparation method includes the following steps: apply a dry film on both sides of the copper foil; expose and develop, so that the surface of the dry film forms a prefabricated silver foot pattern, and the size of the prefabricated silver foot pattern is larger than The shape and size of the actual silver foot pattern; form silver plating in the prefabricated silver foot pattern area; peel off the dry film on both sides of the copper foil; then apply dry film on both sides of the copper foil; exposure, development and etching, after etching the lead frame, the The lead frame is soaked in the first liquid to ...
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Abstract
The invention discloses a preparation method of a lead frame. The preparation method comprises the following steps: coating two sides of a copper foil with dry films; carrying out the exposure and development, so a prefabricated silver foot pattern is formed on the surface of the dry film, and the shape size of the prefabricated silver foot pattern is larger than that of the actual silver foot pattern; forming a silver plating layer in the prefabricated silver foot pattern area; stripping dry films on two sides of the copper foil; covering the two sides of the copper foil with dry films; performing exposing, developing and etching, and soaking the lead frame into the first liquid to enable the lead frame to be electrified; soaking the lead frame in a second liquid, performing electrifying to remove the suspended plating layer, and forming a lead frame pattern on the copper foil; and stripping dry films on two sides of the copper foil. Therefore, the problem of incomplete silver plating is eliminated by increasing the area of the electroplating pattern, and then the added suspended plating layer of the etched lead frame is deplated, so the suspended plating layer on the lead frame is eliminated, and the use performance of the lead frame is improved.
Description
technical field [0001] The invention relates to the field of semiconductor technology, in particular to a method for preparing a lead frame Background technique [0002] In the prior art, the lead frame is usually fabricated by silver-plating coiled copper material, followed by secondary lamination, exposure, and etching according to the electroplating pattern. It can be understood that in the production process of the prior art, the coiled copper needs to be electroplated first and then etched. The film is used as an etching pattern, and the etching pattern of the lead frame needs to be aligned with the target point of the electroplating pattern and the target of the etching exposure mold. Due to the limitation of the precision of exposure equipment, there will be a deviation of 5um-20um in theory during the second alignment. If there is a deviation in the second alignment, it will cause the silver layer to be suspended or the silver plating to be incomplete after etching,...
Claims
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IPC IPC(8): H01L21/48H01L23/495
CPCH01L21/4821H01L21/4828H01L23/495
Inventor 熊绪新彭磊揭海欢郑行彬
Owner 江西新菲新材料有限公司