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Method for improving core board direct pressing type PCB drilling alignment degree

An alignment and core board technology, applied in the direction of circuit board tool positioning, electrical components, printed circuit manufacturing, etc., can solve the problems of stretching, the quality of drilling accuracy decline, affecting the accuracy of positioning holes, etc., to optimize the process flow , Improve the effect of alignment quality

Inactive Publication Date: 2021-06-22
AOSHIKANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] During the resin grinding process of the Book laminated board, due to the grinding and extrusion of the abrasive belt or the ceramic sheet, the board is ground to a large size, and the actual expansion and contraction coefficient of the board after grinding will become higher than the measured level after lamination. In addition, the fixed-pitch positioning holes processed in the line compensation mode of the target drilling machine will also be stretched due to grinding, which seriously affects the accuracy of the positioning holes, thereby greatly reducing the quality of the drilling alignment

Method used

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  • Method for improving core board direct pressing type PCB drilling alignment degree
  • Method for improving core board direct pressing type PCB drilling alignment degree
  • Method for improving core board direct pressing type PCB drilling alignment degree

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no. 1 example

[0032] Please refer to Figure 2-Figure 4 , in the first embodiment of the present invention, the method for improving the alignment of core board direct pressure type PCB drilling includes the following steps:

[0033] 1. Drill positioning holes (for gong edge)

[0034] like image 3 The shown PCB inner layer expansion and contraction Symbol (also known as inner layer expansion and contraction test Pad, interlayer expansion and contraction test Pad, etc.) is a general design module of PCB, usually designed near the four corners of the board edge, and its center line is a standard rectangle . During the processing of the inner layer of the copper clad core board, only the "0" and the Pad at the level are etched. After lamination, the space is superimposed to show the following effect, which is used to monitor the expansion and contraction of each core board after PCB lamination. compatibility.

[0035] Use the center drilling mode of the X-Ray target drilling machine to ca...

no. 2 example

[0051] Based on the method provided in the first embodiment of the present application to improve the alignment of core board direct pressure type PCB drilling, the second embodiment of the present application proposes another method for improving the core board direct pressure type PCB drilling alignment . The second embodiment is only a preferred manner of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0052] The second embodiment of the present invention will be further described below in conjunction with the drawings and implementation methods.

[0053] Please refer to Figure 5-Figure 6 The difference between this embodiment and the first embodiment is that the resin grinding equipment includes a base 1, a hydraulic cylinder 2 is installed on the top side of the base 1, a top plate 3 is installed on the top side of the hydraulic cylinder 2, and the The bottom side of the top...

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Abstract

The invention provides a method for improving core board direct pressing type PCB drilling alignment degree. The method for improving core board direct pressing type PCB drilling alignment degree comprises the following steps: drilling a positioning hole: only etching a '0' position and a Pad of a layer where the '0' position is located during inner layer flow processing of a copper-clad core board, and stacking the '0' position and the Pad in space after lamination so as to monitor the expansion and shrinkage matching of each core board after PCB lamination; capturing a black target by using a center drilling mode of an X-Ray target drilling machine, and drilling four target holes with the same size at '0' expansion and contraction Symbol positions of the upper plate corners to serve as positioning holes for the subsequent edge milling process; outer layer lamination and shaping: carrying out positioning through the four holes, and finishing the processes of board cutting, edge grinding, corner rounding and groove shaping by using a total lattice precision edge shaping machine and a Yingtuo edge grinding machine; resin grinding: grinding the PP glue and the brownification layer of the board face of the Book stacked board to be dry through resin grinding equipment. The method for improving the core board direct pressing type PCB drilling alignment degree has the advantages that the positioning hole precision is high, and the accuracy of the expansion and shrinkage coefficient is high.

Description

technical field [0001] The invention relates to the technical field of PCB board processing, in particular to a method for improving the alignment of core board direct-pressed PCB drilling holes. Background technique [0002] PCB is mainly divided into the following three categories in terms of design stacking: ① ordinary board stacking structure with copper clad core board in the middle and copper foil on both sides; ② Book stacking structure in which copper clad core board is directly pressed Book laminated board); ③The first lamination is an ordinary board laminated structure, followed by adding PP and copper foil to the outer layer to achieve the HDI board laminated structure for the purpose of layering, and other more complex laminated structures are basically in the It is formed by pressing and reprocessing on the basis of the above three stacking structures. [0003] Among them, the first type of ordinary board and the third type of HDI board are the most common, but...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0008H05K3/0047H05K2203/166
Inventor 金浩卓义勇张赟蒋辰峰
Owner AOSHIKANG TECH CO LTD