Micro LED mass transfer mechanism

A large-scale, transfer film technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as positional deviation, low product yield, and film deformation when MicroLED/MiniLED is transferred to the target disk. The effect of mass transfer of precision, improving product yield and ensuring precision

Active Publication Date: 2021-06-25
广东阿达智能装备有限公司
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  • Abstract
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Problems solved by technology

[0003] However, there are currently MicroLED / MiniLED transfer equipment. When the puncture head needles the MicroLED / MiniLED to transfer to the target plate, due to the large size of the transfer film, the film is easily deformed, so that the MicroLED / MiniLED is transferred to the target plate. There is a deviation in the position, which leads to low transfer accuracy of MicroLED / MiniLED, which ultimately affects the quality of the product and leads to low product yield

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  • Micro LED mass transfer mechanism
  • Micro LED mass transfer mechanism
  • Micro LED mass transfer mechanism

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Embodiment Construction

[0024] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0025] Such as Figure 1 to Figure 3 As shown, the MicroLED mass transfer mechanism of the present invention includes a source disk assembly, a target disk assembly, a top suction assembly, and a thorn head assembly; wherein, the source disk assembly is located above the target disk assembly to fix the MicroLED transfer film to be transferred 100; the top suction assembly is installed on the target disk assembly for tensioning the transfer film 100; the puncture head assembly is located above the source disk assembly to transfer the MicroLED acupuncture on the transfer film 100 to the target disk assembly; the target disk assembly Used to carry the transferred ...

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Abstract

The invention provides a MicroLED mass transfer mechanism. The mass transfer mechanism comprises a source disc assembly, a target disc assembly, a top suction assembly and a thorn head assembly; and the source disc assembly is located above the target disc assembly, the top suction assembly is installed on the target disc assembly, and the thorn head assembly is located above the source disc assembly. The top suction assembly comprises a moving plate, a mounting plate mounted on the moving plate, a support mounted on the mounting plate and an annular top suction cup mounted on the support, the interior of the annular top suction cup is a working area, and the annular top suction cup is located above the transfer film. According to the MicroLED mass transfer mechanism, the MicroLED transfer precision is effectively improved, the product yield is improved, and high-precision mass transfer of MicroLEDs is achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductor production equipment, in particular to a mass transfer mechanism for Micro LEDs. Background technique [0002] Mini LED (small-pitch light-emitting diode) refers to LED products with a chip size of 100 μm to 200 μm, and Micro LED (micron light-emitting diode) refers to LEDs with a chip size of less than 100 μm. They are an important development direction of next-generation display technology. Compared with OLED, Micro LED / Mini LED has a higher dynamic range, better contrast and wider range, and has a longer life than OLED, making the Micro LED / Mini LED industry gradually become a hot spot in the entire display industry. [0003] However, there are currently MicroLED / MiniLED transfer equipment. When the puncture head needles the MicroLED / MiniLED to transfer to the target plate, due to the large size of the transfer film, the film is easily deformed, so that the MicroLED / MiniLED is transferred...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L33/00
CPCH01L21/6838H01L33/0095
Inventor 张昕阳贺云波刘青山罗诚言益军关晓鸣
Owner 广东阿达智能装备有限公司
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